Senior ESD/Latch-Up Architect - Next-Gen HBM

Micron Technology, Inc; Folsom (CA); On-site; USD 177,000 - 334,000; Full time

Job summary

Micron Technology, Inc in Folsom, California is seeking a Sr. Member Technical Staff to lead ESD and latch-up architecture for next-generation HBM products. The ideal candidate will have a strong background in ESD design and reliability, with 10+ years of experience, and will work across teams to solve complex reliability challenges.

This role involves defining protection strategies, establishing standards, and partnering with foundry and packaging teams to enhance product reliability.

The salary range for this position is $177,000 – $334,000 per year, with potential additional compensation.

Qualifications

• 10+ years of experience in ESD and latch‑up design and reliability.
• Expertise in advanced CMOS technologies such as FinFET or GAA.
• Experience with 3D IC, TSV, or die-to-die interfaces.

Responsibilities

• Define end-to-end ESD and latch‑up architecture across base die, DRAM die, and interconnects.
• Develop protection strategies for high-speed I/O, TSV interfaces, and advanced packaging.
• Drive correlation between design assumptions, silicon validation, and field reliability.

Skills

ESD design

Latch-up design

Advanced CMOS technologies

3D IC

Technical leadership

Education

MS or PhD in Electrical Engineering

Job description

Micron Technology, Inc in Folsom, California is seeking a Sr. Member Technical Staff to lead ESD and latch-up architecture for next-generation HBM products. The ideal candidate will have a strong background in ESD design and reliability, with 10+ years of experience, and will work across teams to solve complex reliability challenges.

This role involves defining protection strategies, establishing standards, and partnering with foundry and packaging teams to enhance product reliability.

The salary range for this position is $177,000 – $334,000 per year, with potential additional compensation.