Senior HBM ESD & Latch-Up Architect

Micron Technology; Folsom (CA); On-site; USD 177,000 - 334,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid family leave

Robust paid time‑off program

Job summary

Micron Technology is looking for a Senior Engineer as an SMTS/DMTS HBM ESD/Latch‑Up Architect to lead the definition of ESD and latch‑up architecture across various components. The ideal candidate will have over 10 years of experience and a strong background in advanced CMOS technologies.

The role includes developing protection strategies and collaborating with cross‑functional teams. Compensation ranges from $177,000 to $334,000 per year, in addition to various benefits tailored to meet healthcare needs.

Qualifications

• 10+ years of experience in ESD and latch‑up design and reliability.
• Expertise in advanced CMOS technologies such as FinFET or GAA.
• Experience with 3D IC, TSV, or die‑to‑die interfaces.

Responsibilities

• Define end-to-end ESD and latch‑up architecture across base die, DRAM die, and interconnects.
• Develop protection strategies for high‑speed I/O, TSV interfaces, and advanced packaging.
• Drive correlation between design assumptions, silicon validation, and field reliability.

Skills

ESD and latch‑up design

Advanced CMOS technologies

Technical leadership

Education

MS or PhD in Electrical Engineering or related field

Job description

Micron Technology is looking for a Senior Engineer as an SMTS/DMTS HBM ESD/Latch‑Up Architect to lead the definition of ESD and latch‑up architecture across various components. The ideal candidate will have over 10 years of experience and a strong background in advanced CMOS technologies.

The role includes developing protection strategies and collaborating with cross‑functional teams. Compensation ranges from $177,000 to $334,000 per year, in addition to various benefits tailored to meet healthcare needs.