Senior Engineer - Underground Paste Backfill

WSP in the U.S.; Elko (NV); On-site; USD 180,000 - 260,000; Full time

Job summary

WSP USA is seeking a Lead Underground Paste Backfill Engineer to join our Salt Lake City, UT office, with consideration for Reno or Elko, NV. You will lead underground paste backfill activities and coordinate multidisciplinary teams to meet project objectives.

Responsibilities include establishing design criteria, leading design reviews and risk assessments, supporting commissioning, and ensuring safe, on-time delivery across EPCM processes.

Qualifications

• Bachelor’s degree in mining engineering, Mechanical Engineering, Civil Engineering, or related discipline.

Responsibilities

• Lead the planning, execution, and delivery of all underground paste backfill engineering activities.
• Manage multidisciplinary engineering teams, consultants, and specialist resources.
• Monitor engineering progress, budgets, forecasts, schedules, and deliverables.
• Coordinate interfaces between mining, process, mechanical, piping, electrical, controls, geotechnical, civil, and construction teams.
• Support project controls, risk management, change management, and reporting activities.
• Lead commissioning strategies, test plans, and acceptance criteria.
• Provide technical guidance during construction and field engineering.
• Review RFIs, submittals, and field changes.

Skills

Mining engineering

Project leadership

Team leadership

QA/QC

Technical writing

Education

Bachelors in Mining Eng

PE or P.Eng (preferred)

Tools

Discipline-specific design software

Job description

WSP USA is seeking a Lead Underground Paste Backfill Engineer to join our Salt Lake City, UT office, with consideration for Reno or Elko, NV. You will lead underground paste backfill activities and coordinate multidisciplinary teams to meet project objectives.

Responsibilities include establishing design criteria, leading design reviews and risk assessments, supporting commissioning, and ensuring safe, on-time delivery across EPCM processes.