Senior Engineer – Real-Time Metrology for Advanced Packages

Micron Technology, Inc.

Boise (ID)

On-site

USD 94,000 - 141,000

Full time

10 days ago

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Job summary

Micron Technology, Inc. in Singapore seeks a Senior Engineer specializing in Advanced Package Metrology with real-time defect analysis to support next‑generation packaging.

You will develop precise measurement methods and analyze defects as they occur, enabling rapid corrective actions. The role requires close collaboration with process and metrology teams to deliver data-driven insights, optimize yield, and improve device reliability while advancing packaging technology in a fast-paced

Job description

Micron Technology, Inc. in Singapore seeks a Senior Engineer specializing in Advanced Package Metrology with real-time defect analysis to support next‑generation packaging.

You will develop precise measurement methods and analyze defects as they occur, enabling rapid corrective actions. The role requires close collaboration with process and metrology teams to deliver data-driven insights, optimize yield, and improve device reliability while advancing packaging technology in a fast-paced

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