Senior Embedded OS Architect - Automotive Platform

General Motors; Sunnyvale (CA); On-site; USD 180,000 - 260,000; Full time

Job summary

General Motors is seeking a Senior Platform OS Engineer to join the AV Platform team. You will lead Linux/QNX OS development, BSP bring-up, and low-level platform services for GM's SDV and AV solutions.

The role involves cross-layer debugging, collaboration with silicon vendors, and mentoring engineers on BSP and OS internals. Excellent knowledge of PCIe, CAN, SPI, I2C, UART, and production-grade embedded systems is expected.

Qualifications

• 12+ years in embedded systems or low-level software development.
• Hands-on experience with Linux, QNX in production environments.
• Proficiency in Embedded C/C++ for low-level software.
• Experience with boot issues, IPC, and device bring-up.

Responsibilities

• Lead Linux/QNX platform OS development and integration for current production Super Cruise programs.
• Own BSP bring-up, integration, and debugging across Linux- and QNX-based environments.
• Design, implement, and maintain low-level platform services, system daemons, and resource-managed interfaces.
• Define platform OS architecture including IPC, scheduling, interrupts, and system startup flows.
• Develop Embedded C/C++ for OS components, BSP layers, drivers, and system libraries.
• Drive board and platform bring-up for Super Cruise hardware, including clocks, memory, PCIe, UART, SPI, I2C, and peripherals.
• Debug cross-layer issues using logs, traces, dumps, and lab tools.
• Collaborate with silicon vendors, security teams, validation teams, and release teams.

Skills

Linux

QNX

Embedded C/C++

BSP bring-up

OS debugging

Arm/x86

CI/CD

Tools

GDB

JTAG

Tracing

Job description

General Motors is seeking a Senior Platform OS Engineer to join the AV Platform team. You will lead Linux/QNX OS development, BSP bring-up, and low-level platform services for GM's SDV and AV solutions.

The role involves cross-layer debugging, collaboration with silicon vendors, and mentoring engineers on BSP and OS internals. Excellent knowledge of PCIe, CAN, SPI, I2C, UART, and production-grade embedded systems is expected.