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Lockheed Martin's Fleet Ballistic Missile Avionics team seeks an Electronics Packaging Engineer to develop 3D concept models for space flight avionics hardware and advance them for flight use.
You will design antenna panels from a mechanical perspective, coordinate with thermal and structural analysts, prepare drawings for fabrication, and interface with Parts Engineering, QA and Purchasing to ensure producible designs that meet schedule and cost targets.
Lockheed Martin's Fleet Ballistic Missile Avionics team seeks an Electronics Packaging Engineer to develop 3D concept models for space flight avionics hardware and advance them for flight use.
You will design antenna panels from a mechanical perspective, coordinate with thermal and structural analysts, prepare drawings for fabrication, and interface with Parts Engineering, QA and Purchasing to ensure producible designs that meet schedule and cost targets.