Avionics Packaging Mechanical Engineer

Harris Geospatial Solutions

Palm Bay (FL)

Hybrid

USD 90,000 - 120,000

Full time

4 days ago
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Job summary

L3Harris Technologies is seeking an Electronic Packaging / Mechanical Engineer to design, analyze and validate avionics assemblies from concept to hardware integration. You will work with designers, thermal/structural analysts, systems engineers and program managers to ensure rugged performance in demanding environments.

The role emphasizes mechanical, electro‑mechanical and opto‑mechanical design, with strong emphasis on cross‑functional collaboration, documentation, and compliance for

Qualifications

  • Bachelor’s degree in engineering with 4+ years relevant experience.
  • Graduate degree with 2+ years related experience.
  • In lieu of a degree, 8+ years of related experience.

Responsibilities

  • Develop complex mechanical designs for avionics electronics assemblies.
  • Analyze thermal, structural, and power aspects and support analyses.
  • Collaborate with cross‑functional teams to develop new solutions.
  • Package electronics for rugged avionics platforms including testing and validation.
  • Support design control documentation and part/vendor interactions.
  • Ensure manufacturability and assembly considerations (DFM/DFMA).
  • Assist in risk reduction and interface with customers and program managers.
  • Obtain required government security clearance as needed.

Skills

Mechanical design
3D CAD Modeling
GD&T
ASME Y14.5
DFM/DFMA
Electro-mechanical packaging

Education

Bachelor’s degree in engineering
Graduate degree
8+ years experience in lieu of degree

Tools

PTC Creo
Catia
NX
SolidWorks

Job description

L3Harris Technologies is seeking an Electronic Packaging / Mechanical Engineer to design, analyze and validate avionics assemblies from concept to hardware integration. You will work with designers, thermal/structural analysts, systems engineers and program managers to ensure rugged performance in demanding environments.

The role emphasizes mechanical, electro‑mechanical and opto‑mechanical design, with strong emphasis on cross‑functional collaboration, documentation, and compliance for

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