Avionics Packaging Mechanical Engineer

Harris Geospatial Solutions; Palm Bay (FL); On-site; USD 90,000 - 120,000; Full time

Job summary

L3Harris Technologies in Palm Bay, FL seeks an Electronic Packaging / Mechanical Engineer to work with a cross-functional team to develop avionics systems from conceptualization through hardware integration and testing.

The role involves mechanical engineering activities for design, analysis, documentation, processing, fabrication, assembly, and qualification of products to specification, including packaging electronics for rugged environments.

Qualifications

• Bachelor’s degree in engineering with 4+ years of related experience; graduate degree with 2+ years.
• In lieu of a degree, 8 years of related experience.
• Experience with avionics systems and hardware development.

Responsibilities

• Develop avionics mechanical designs and layouts.
• Collaborate with cross-functional teams across engineering disciplines.
• Perform thermal, structural analyses and testing support.
• Interface with suppliers to source parts.
• Create design documentation and design controls.
• Assist with packaging electronics for rugged environments.
• Support manufacturing and assembly processes.

Skills

Mechanical design

Requirements analysis

3D CAD modeling

GD&T

Electronics packaging

Avionics products

DFM/DFMA

Military environments

Machined parts design

Sheet metal design

Education

Bachelor's degree in engineering

Graduate degree

Tools

PTC Creo

Catia

NX

SolidWorks

MS Office

Job description

L3Harris Technologies in Palm Bay, FL seeks an Electronic Packaging / Mechanical Engineer to work with a cross-functional team to develop avionics systems from conceptualization through hardware integration and testing.

The role involves mechanical engineering activities for design, analysis, documentation, processing, fabrication, assembly, and qualification of products to specification, including packaging electronics for rugged environments.