Senior ECAD Architect – SoC Tooling

Arm; Chandler (AZ); Hybrid; USD 250,000 - 338,000; Full time

Job summary

Arm seeks an ECAD Principal Engineer to join the System-in-Package team, driving automation and data transfer across ECAD workflows. You will help customize toolsets and prepare next-gen SoCs for IoT, automotive, and compute applications.

The role emphasizes collaboration with multiple teams and vendor interfaces. Ideal candidates have 15+ years with Cadence APD/Allegro, 2.5D/3D packaging, and strong scripting (SKILL, TCL, Python).

Qualifications

• Electrical Engineering degree or equivalent work experience.
• Experience with 2.5D and 3D package systems and facilitating layout process improvements.
• 15+ years using Cadence APD & Allegro toolsets with recent experience using V24, V25; Siemens HyperLynx, Ansys and Valor.
• Significant experience in programming languages such as SKILL, TCL, Ravel, Codex, Python.
• Design, development and deployment of Custom Tools in large layout installations.
• History of Product support and internal regression testing techniques.

Responsibilities

• Coordinate with multiple teams to architect/develop automation for data transfer and checking.
• Interface with ECAD vendors on development requirements and issue resolution.
• Support library development by creating symbols and CAD databases using Cadence tools.
• Develop methodologies to improve layout efficiency.
• Carry out layout development using best practices for DFM, DFA, and PDN.
• Provide use-model support to internal teams across the design tools.

Skills

Programming languages: SKILL, TCL, RAV

Custom Tools development

Product support & regression testing

Layout process improvements

Education

Electrical Engineering degree or equivalent

Tools

Cadence APD

Allegro

Siemens HyperLynx

Ansys

Valor

Job description

Arm seeks an ECAD Principal Engineer to join the System-in-Package team, driving automation and data transfer across ECAD workflows. You will help customize toolsets and prepare next-gen SoCs for IoT, automotive, and compute applications.

The role emphasizes collaboration with multiple teams and vendor interfaces. Ideal candidates have 15+ years with Cadence APD/Allegro, 2.5D/3D packaging, and strong scripting (SKILL, TCL, Python).