Global Sr. Director, GaN/SiC Package Design

Navitas Semiconductor Usa; Raleigh (NC); On-site; USD 180,000 - 240,000; Full time

Benefits offered by this job

Health, dental, and vision coverage

Unlimited PTO

Equity awards

Job summary

Navitas Semiconductor Usa is seeking a Senior Director of Package Design & Engineering to lead global package architecture, design, and qualification for GaN and SiC products. This role drives the technology roadmap, guides a worldwide engineering organization, and partners with OSATs to ensure robust, cost-effective package platforms.

The candidate will manage design rules, release criteria, and risk mitigation while advancing nex gen packaging capabilities for high-performance power devices.

Qualifications

• 15+ years in semiconductor package design or related field.
• Experience leading multidisciplinary engineering teams.
• Experience with OSATs or outsourced manufacturers.

Responsibilities

• Own global package design and engineering roadmap for GaN/SiC products.
• Lead architecture, design, materials, and process development.
• Drive qualification and manufacturing readiness for package platforms.

Skills

Leadership

Package design

DFMEA

Cross-functional

Global team leadership

Education

MS/PhD in Mechanical, Electrical, Materials

Tools

ANSYS

SolidWorks

Job description

Navitas Semiconductor Usa is seeking a Senior Director of Package Design & Engineering to lead global package architecture, design, and qualification for GaN and SiC products. This role drives the technology roadmap, guides a worldwide engineering organization, and partners with OSATs to ensure robust, cost-effective package platforms.

The candidate will manage design rules, release criteria, and risk mitigation while advancing nex gen packaging capabilities for high-performance power devices.