Senior Director, Package Design & Engineering

Navitas Semiconductor Usa; Raleigh (NC); On-site; USD 180,000 - 240,000; Full time

Benefits offered by this job

Health, dental, and vision coverage

Unlimited PTO

Equity awards

Job summary

Navitas Semiconductor Usa is seeking a Senior Director of Package Design & Engineering to lead global package architecture, design, and qualification for GaN and SiC products. This role drives the technology roadmap, guides a worldwide engineering organization, and partners with OSATs to ensure robust, cost-effective package platforms.

The candidate will manage design rules, release criteria, and risk mitigation while advancing nex gen packaging capabilities for high-performance power devices.

Qualifications

• 15+ years in semiconductor package design or related field.
• Experience leading multidisciplinary engineering teams.
• Experience with OSATs or outsourced manufacturers.

Responsibilities

• Own global package design and engineering roadmap for GaN/SiC products.
• Lead architecture, design, materials, and process development.
• Drive qualification and manufacturing readiness for package platforms.

Skills

Leadership

Package design

DFMEA

Cross-functional

Global team leadership

Education

MS/PhD in Mechanical, Electrical, Materials

Tools

ANSYS

SolidWorks

Job description

Job Details: Job Location: NC - Raleigh, NC, Position Type: Full Time, Salary Range: Undisclosed, Job Purpose

Navitas Semiconductor (Nasdaq: NVTS) is a next-generation power semiconductor leader driving innovation in gallium nitride (GaN) and high-voltage silicon carbide (SiC) technologies. Our products enable faster, more efficient power delivery across AI data centers, high-performance computing, energy and grid infrastructure, electric mobility, and industrial electrification.

We are seeking a Senior Director, Package Design & Engineering to lead package architecture, design, development and qualification across Navitas' GaN and SiC portfolio. This leader will define the package technology roadmap and guide global engineering execution for advanced discrete and power IC packages from concept through high-volume manufacturing.

The successful candidate will combine deep technical expertise in power semiconductor packaging, assembly processes, materials, simulation, reliability, and new product introduction with the leadership skills to build high-performing teams, strengthen OSAT execution, and deliver robust package platforms that meet performance, quality, cost, and schedule commitments.

Leadership Roles and Responsibilities

• Own and execute the global package design and engineering roadmap for GaN and SiC products, aligned with product, technology and business priorities.
• Build, lead, and develop a global organization spanning package architecture, design, materials, process development, simulation, qualification, and manufacturing readiness.
• Lead package platform development from concept selection and feasibility through design freeze, qualification, safe launch, volume ramp, and post-release improvement.
• Establish clear technical requirements, design rules, development methods, decision gates, and release criteria for package and IC programs.
• Create a disciplined engineering culture centered on technical excellence, accountability, rapid learning cycles, data-driven decisions, and on-time closure of risks and actions.
• Partner with Engineering, Reliability, Quality, Supply Chain, and Business Units to deliver integrated product solutions.
• Lead technical engagement with OSATs, material suppliers, tooling vendors, equipment suppliers, external laboratories, and strategic technology partners.
• Develop supplier capability and second-source strategies that improve technology access, capacity resilience, cost competitiveness, and continuity of supply.
• Serve as the senior technical escalation point for package design, assembly, qualification, reliability, and manufacturing issues.
• Represent Navitas in customer technical reviews and executive-level discussions involving package architecture, performance, reliability, manufacturability, and development risk.

Technical Roles and Responsibilities

• Define and deliver advanced package architectures for power discretes and IC products.
• Lead package layout and design optimization for electrical parasitics, current density, thermal resistance, thermo-mechanical stress, isolation, creepage and clearance, reliability, manufacturability, and cost.
• Guide electrical, thermal, electro-thermal, and mechanical simulation, including finite-element analysis, warpage and stress modeling, material-interface assessment, and design sensitivity studies.
• Drive selection, characterization, and qualification of leadframes, substrates, die-attach and sintering materials, wires, ribbons, clips, molding and encapsulation compounds, housings, thermal-interface materials, and insulation systems.
• Define robust assembly processes and process windows for die attach, sintering, wire/ribbon/clip bonding, flip-chip attach, molding, encapsulation, substrate attach, housing assembly, cleaning, curing, marking, and traceability.
• Lead DFMEA, design reviews, tolerance analysis, DOE, process characterization, SPC, Cpk improvement, cost optimization, and technical risk mitigation activities throughout development.
• Drive qualification planning and execution to applicable JEDEC, AEC-Q, customer, industrial, and internal requirements in partnership with Reliability Engineering.
• Lead root-cause analysis and corrective action for package failures such as delamination, die-attach voiding, interconnect degradation, mold or housing cracking, warpage, moisture ingress, thermal overstress, isolation breakdown, and partial-discharge failures.
• Own package documentation including requirements, drawings, bill of material, process flows, specifications, control plans, qualification reports, and release packages.
• Establish package platform reuse and design-rule strategies that accelerate NPI while improving quality, development efficiency, and manufacturing scalability.
• Work with Operations manufacturing team to ensure manufacturing readiness at OSATs through capability assessments, equipment and tooling readiness, pilot builds, safe launch, yield monitoring, capacity planning, and post-release improvement.
• Advance technical capability through competitive benchmarking, intellectual property development, external partnerships, and selective adoption of emerging package and interconnect technologies.

Qualifications: Required Qualifications

• M.S or Ph.D. in Mechanical Engineering, Electrical Engineering, Materials Science or related technical discipline.
• 15+ years of semiconductor package design, package development, assembly process engineering, or power module development experience, including significant technical and people leadership responsibility.
• Proven experience taking semiconductor package platforms from concept and design through qualification, production release, and manufacturing ramp.
• Deep knowledge of power package architecture, materials, assembly processes, thermal and mechanical behavior, electrical parasitics, qualification, and failure mechanisms.
• Demonstrated experience leading multidisciplinary and geographically distributed engineering teams.
• Hands‑on experience working with OSATs or outsourced manufacturing partners on development, qualification, process capability, yield improvement, and production ramp.
• Experience leading complex cross‑functional development programs involving device, product, test, reliability, quality, supply chain, operations, suppliers, and customers.
• Strong command of structured engineering methods including DFMEA, DFM, DFR, DOE, SPC, Cpk, design reviews, qualification planning, root‑cause analysis, and corrective action.
• Excellent communication, technical judgment, executive presentation, organizational leadership, and data‑driven decision‑making skills.
• Ability to travel internationally as required.

Preferred Technical Expertise

• Package development for SiC, GaN, IGBT, MOSFET, integrated power stages, or intelligent power modules.
• Experience with a wide range of discrete packages and high‑power module platforms.
• Advanced interconnect and assembly technologies such as copper clip, flip‑chip, aluminum ribbon, high‑current wire bonding, and silver sintering.
• Thermal, electrical, and mechanical simulation using tools such as ANSYS, SolidWorks, or equivalent engineering platforms.
• High‑voltage and high‑power packaging, including thermal management, current sharing, electric‑field management, insulation, creepage and clearance, and partial‑discharge mitigation.
• AI datacenter, industrial, energy storage, renewable energy, or grid‑infrastructure applications.
• Experience developing package technology roadmaps, reusable design platforms, intellectual property, and global engineering capability during periods of rapid growth.

Leadership Expectations

• Set a clear technical vision and translate it into an executable roadmap, organization plan, and measurable program commitments.
• Develop technical leaders and succession capability across the global package engineering organization.
• Promote fact‑based decision‑making, early risk identification, transparent escalation, and disciplined follow‑through.
• Create strong partnerships across engineering, operations, business teams, suppliers, and customers.
• Balance innovation with execution discipline, manufacturability, quality, cost, and speed to market.
• Model Navitas values through ownership, accountability, collaboration, integrity, and respect.

What We Offer

• A front‑row seat to the future of power electronics, working on GaN and SiC technologies transforming AI data centers, electrification, and global energy infrastructure.
• A fast‑paced environment where employees are empowered to take ownership and deliver meaningful impact.
• A collaborative global team committed to technical excellence, customer success, and reliable execution.
• Access to leadership, cross‑functional partners, and the resources needed to innovate and execute at a high level.
• Competitive total rewards, including health, dental, and vision coverage, unlimited PTO, and a compensation package with base salary, performance bonus, and equity awards.

Base Salary Range

Competitive compensation package depending on experience, qualifications, and location.