Senior Design Engineer/Architect, HBM

Micron Technology, Inc; Richardson (TX); On-site; USD 110,000 - 170,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off

Paid holidays

Benefits guide

Job summary

Micron Technology, Inc. in Richardson, TX seeks a Senior Design Engineer/Architect for high-speed HBM datapath development.

You will architect, design, and optimize datapath circuitry for next-gen HBM products and define system requirements for HW/SW compatibility, leveraging AI to enhance analysis. Collaborating across design, PHY, ECC, verification, layout and system teams, you will guide subsystem integration, resolve design challenges, and contribute through silicon bring-up.

Qualifications

• Bachelor’s degree in Electrical/Computer Engineering with 4+ years experience.
• Master’s degree in Electrical/Computer Engineering with 2+ years experience.
• Experience architecting high-speed datapath circuitry and HW/SW specs.

Responsibilities

• Architect, design, and optimize datapath circuitry for HBM products.
• Define system specifications and I/O processes.
• Coordinate subsystem design across multi-functional teams.
• Identify and resolve design and program support deficiencies.
• Support silicon bring-up and corrective actions.

Education

Bachelor’s degree in Electrical/Computer Engineering

Master’s degree in Electrical/Computer Engineering

Datapath architecture

High-speed circuitry

System requirements

HW/SW specifications

Subsystem integration

AI analysis

Job description

Req ID: JR93489 Senior Design Engineer/Architect, HBM

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The HBM Architecture team develops advanced datapath solutions that enable industry‑leading bandwidth, power efficiency, reliability, and scalability for Micron’s next‑generation High Bandwidth Memory (HBM) products. The team collaborates closely across design, PHY, ECC, verification, layout, and system groups to drive innovative logic‑die and core‑die architectures from concept through production.

This position focuses on architecting, designing, and optimizing high‑speed datapath circuitry for JEDEC and custom HBM solutions. The role defines complex system requirements, ensures subsystem integration, and supports development through silicon bring‑up while resolving design and program support challenges.

Responsibilities:

• Architect, design, and optimize logic‑die and core‑die datapath circuitry for next‑generation HBM products.
• Determine system specifications, input/output processes, and working parameters for hardware/software compatibility, leveraging AI to enhance analysis and decision‑making.
• Coordinate subsystem design and integration across multi‑functional teams.
• Identify, analyze, and resolve system or program support deficiencies.
• Develop and recommend corrective actions to ensure robust datapath performance.

Minimum Qualifications:

• Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field with 4 years of relevant industry experience or a Master’s degree in Electrical Engineering, Computer Engineering, or a related field with 2 years of relevant industry experience.
• Experience architecting, designing, or optimizing high‑speed datapath circuitry.
• Ability to define and implement complex system requirements, identify issues, analyze root causes, and recommend corrective actions.
• Experience determining hardware/software system specifications and I/O processes.
• Experience coordinating subsystem design and system integration activities.

Preferred Qualifications:

• PhD in Electrical Engineering, Computer Engineering, or related field
• Experience working with JEDEC or custom HBM solutions.
• Experience collaborating with design, PHY, ECC, verification, layout, or system engineering teams.

Job Profile(s):

Systems Design Engineer 3 - Systems Design Engineer 5

Relocation Level: TBD

Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.