Principal Engineer - HIG HBM - ARCHITECTURE

Micron Technology, Inc.

Richardson (TX)

Presencial

USD 140.000 - 190.000

Jornada completa

14 días+

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Ventajas ofrecidas por este puesto de trabajo

Medical Insurance
Dental Insurance
Vision Insurance
Paid Time Off
Paid Holidays

Descripción de la vacante

Micron Technology is seeking an experienced HBM Architecture Engineer to define and drive the architecture of high-speed analog and mixed-signal IO subsystems for HBM products. You will influence architecture choices and mentor teams across design and product engineering to translate concepts into silicon.

The role focuses on PHY IO architecture, timing methodologies, calibration schemes, and silicon learning frameworks to achieve industry-leading bandwidth, power efficiency, and robustness.

Formación

  • MS or PhD in Electrical Engineering or related field.
  • 7+ years of semiconductor design, architecture, or technology development.
  • Expertise in analog and mixed-signal IO design and architecture.
  • Deep knowledge of high-speed transmitter/receiver, clocking, and timing architectures.

Responsabilidades

  • Define and drive next-generation HBM PHY and IO architecture balancing perf, power, area, and reliability.
  • Architect transmit/receive paths including clocking, signaling, equalization, timing alignment, and interface optimization.
  • Define and optimize analog calibration architectures and adaptive tuning methodologies.
  • Develop IO timing budgets, design targets, and margins across process/voltage/temperature/packaging.

Conocimientos

HBM IO architecture
Analog/mixed-signal design
High-speed transmitter/receiver
Clocking/timing architectures
Technical communication

Educación

MS or PhD in EE or related field

Herramientas

Circuit modeling

Descripción del empleo

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The High-Performance Integrated Group (HIG) develops next-generation High Bandwidth Memory (HBM) solutions for AI, machine learning, and high-performance computing applications. We are seeking an experienced HBM Architecture Engineer to define and drive the architecture of high-speed analog and mixed-signal IO subsystems for HBM products. This role focuses on PHY IO architecture, timing methodology, analog calibration schemes, and silicon learning frameworks that enable industry-leading bandwidth, power efficiency, and robustness. The successful candidate will collaborate across Design, Product Engineering, Modeling, Verification, Packaging, and System Architecture teams to define architectural requirements, drive technology innovation, and ensure successful translation from concept to silicon. As a technical leader, you will influence future HBM roadmap decisions, develop engineering methodologies, and mentor design teams on architectural principles, calibration strategies, and best practices for high-speed IO design.

Key Responsibilities
  • Define and drive next-generation HBM PHY and IO architecture, balancing performance, power, area, reliability, and manufacturability requirements.
  • Architect high-performance transmit and receive paths, including clocking, signaling, equalization, timing alignment, and interface optimization.
  • Define and optimize analog calibration architectures, including impedance calibration, reference voltage calibration, timing calibration, and adaptive tuning methodologies.
  • Develop and maintain IO timing budgets, design targets, and margin methodologies across process, voltage, temperature, and package variations.
Required Qualifications
  • MS or PhD in Electrical Engineering or a related field.
  • 7+ years of experience in semiconductor design, architecture, or technology development.
  • Demonstrated expertise in analog and mixed-signal IO design and architecture.
  • Deep knowledge of high-speed transmitter, receiver, clocking, and timing architectures.
  • Strong technical communication and documentation skills.
Preferred Qualifications
  • Experience with HBM, DDR, UCIe, PCIe, or other high-speed memory and interconnect technologies.
  • Experience developing and evaluating analog calibration schemes, including impedance calibration, reference voltage calibration, timing calibration, adaptive and background calibration techniques.
  • Experience with advanced packaging technologies, including 2.5D, 3D integration, and TSV-based systems.
  • Background in clock generation, clock distribution, PLLs, phase alignment, or timing recovery circuits.
  • Experience with silicon bring-up, product engineering, or post-silicon debug.
  • Demonstrated use of AI-enabled analytics or automation techniques to improve design quality, silicon analysis, or engineering productivity.
  • Experience developing design methodologies, architecture standards, and engineering training material.
  • Strong understanding of simulation, modeling, silicon characterization, and simulation-to-silicon correlation.
  • Proven ability to perform architectural tradeoff analysis across performance, power, area, and reliability constraints.
Benefits
  • We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
  • Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
  • Additionally, Micron benefits include a robust paid time-off program and paid holidays.

For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer.

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

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