Staff Design Engineer, HBM Architecture

Micron Technology, Inc; Richardson (TX); On-site; USD 146,000 - 297,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. is seeking an HBM Datapath Architect to design and optimize high-speed datapaths for next-generation HBM products, collaborating across design, PHY, ECC, verification, layout, and system teams to drive architecture from concept to production.

The role focuses on logic-die and core-die datapath circuitry, aiming for industry-leading bandwidth, power efficiency, reliability, and scalability across JEDEC and custom HBM solutions, with opportunities to influence silicon

Qualifications

• 7+ years of relevant industry experience in high-speed digital datapath design (memory, SerDes, or SoC datapath).
• 3+ years of hands-on experience with digital schematic build, RTL, or mixed-signal datapath implementations.

Responsibilities

• Architect and design HBM read and write datapath across core and logic die, including alignment, buffering, timing, and control logic.
• Develop high-speed, low-latency datapath circuits supporting multi-channel HBM architectures.
• Optimize datapath designs for bandwidth, power, area, and timing closure at advanced technology nodes.
• Design and integrate data reliability features, including parity, ECC hooks, lane redundancy, and remapping mechanisms.
• Collaborate with multi-functional teams to translate specifications into robust micro-architectures.
• Drive schematic-level and RTL-level datapath implementations, including clocking, gating, and reset strategies.

Skills

High-speed datapath design

RTL

Schematic build

Education

Bachelor's degree in Electrical Engineering or Computer Engineering

Job description

Job Description

The HBM Architecture team develops advanced datapath solutions that enable industry‑leading bandwidth, power efficiency, reliability, and scalability for Micron’s next‑generation High Bandwidth Memory (HBM) products. The team collaborates closely across design, PHY, ECC, verification, layout, and system groups to drive innovative logic‑die and core‑die architectures from concept through production.

We are seeking a highly motivated HBM Datapath Architect to architect, design, and optimize high‑speed data paths for next‑generation High Bandwidth Memory (HBM) products! This role focuses on logic‑die and core‑die datapath circuitry, enabling industry‑leading bandwidth, power efficiency, reliability, and scalability across JEDEC and custom HBM solutions. The ideal candidate will work closely with design, PHY, ECC, verification, layout, and system teams to deliver robust datapath designs from concept through silicon bring‑up and production.

Responsibilities

• Architect and design HBM read and write datapath across core and logic die, including alignment, buffering, timing, and control logic
• Develop high‑speed, low‑latency datapath circuits supporting multi‑channel HBM architectures and wide internal buses
• Optimize datapath designs for bandwidth, power, area, and timing closure at advanced technology nodes
• Design and integrate data reliability features, including parity, ECC hooks, lane redundancy, and remapping mechanisms
• Collaborate with multi‑functional teams to translate specifications into robust micro‑architectures
• Collaborate with PHY, DFT, verification, and layout teams to ensure accurate functionality, testability, and manufacturability
• Drive schematic‑level and RTL‑level datapath implementations, including clocking, gating, and reset strategies
• Contribute to design reviews, documentation, and technical mentoring across HBM programs
• Demonstrate proficiency in using AI‑enabled tools (e.g., Microsoft Copilot and other approved AI solutions) to improve productivity, streamline workflows, analyze information, and accelerate problem solving.

Required Qualifications

• Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field with 7+ years of relevant industry experience, or a Master’s degree with 5+ years of relevant industry experience.
• 3 + years of experience in high‑speed digital datapath design (memory, SerDes, or SoC datapath).
• 3+ years of hands‑on experience with digital schematic build, RTL, or mixed‑signal datapath implementations.

Preferred Qualifications

• Strong understanding of HBM/DRAM architectures, including read/write data flow, timing, and multi‑channel operation.
• Working knowledge of layout and floorplanning considerations for high‑speed datapath.
• Experience with static timing analysis (STA) and timing‑closure methodologies.
• Familiarity with advanced process‑node challenges related to signal integrity, skew control, and power optimization.

Job Profile(s)

Systems Design Engineer 4 - Systems Design Engineer 5

Relocation Level: TBD

Salary

The US base salary range that Micron Technology estimates it could pay for this full‑time position is: $146,000.00 - $297,000.00 a year

Additional compensation may include benefits, bonuses and equity. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target base pay for new hire salaries of the position across all US locations. Within the range, individual pay is determined by work location and additional job‑related factors, including knowledge, skills, experience, tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits.

Benefits

• Choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• Benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
• Robust paid time‑off program and paid holidays.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at [e-mail] or 1-800-336-8918 (select option #3).