Senior CPU Physical Design & Tape-Out Lead

NUVACORE

Santa Clara (CA)

On-site

USD 180,000 - 240,000

Full time

2 days ago
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Job summary

Nuvacore is building ground-up high performance, low-power CPU for next-generation compute workloads. As a CPU Physical Design Integration engineer, you will lead end-to-end integration, physical verification and final tape-out signoff checks, collaborating with packaging, CAD, RTL and foundry teams.

The role demands deep expertise in PV, PERC, ESD, bump and RDL, and a track record of multiple SOC tape-outs on modern nodes.

Qualifications

  • BS or MS in electrical/computer engineering is required.
  • 12+ years of experience in CPU PD integration for lead roles; or 5+ years for individual contributors.
  • Deep expertise in Physical Verification, PERC, ESD, Bump & RDL.
  • Expertise in CPU blocks lego planning based on technology rules.
  • Experience with end-to-end physical design implementation and signoff.

Responsibilities

  • Lead and/or participate in floorplan development and area optimization.
  • Own end-to-end Physical Design Integration methodology and execution.
  • Drive PV, PERC, and ESD signoff efforts.
  • Own bump and RDL design with the packaging team.
  • Manage analog interfaces, signal construction and implementation.
  • Interface with foundry and technology teams as needed.
  • Develop Tools, Flow and Methodology (TFM) with the CAD team across domains.
  • Collaborate with CPU and subsystem owners, CAD/RTL teams as needed.

Skills

Strong communication
CPU physical design
Physical verification
PERC
ESD
Bump & RDL

Education

BS or MS in Electrical/Computer Engineering

Tools

Siemens EDA
Synopsys
Cadence

Job description

Nuvacore is building ground-up high performance, low-power CPU for next-generation compute workloads. As a CPU Physical Design Integration engineer, you will lead end-to-end integration, physical verification and final tape-out signoff checks, collaborating with packaging, CAD, RTL and foundry teams.

The role demands deep expertise in PV, PERC, ESD, bump and RDL, and a track record of multiple SOC tape-outs on modern nodes.

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