Senior Copper Tech Architect - High-Speed Interconnect

Infraeo; Round Rock (TX); On-site; USD 180,000 - 280,000; Full time

Job summary

Infraeo is seeking a Principal Engineer, High-Speed Copper Technology to lead the full copper portfolio, from strategy to end-of-life. Based onsite in Round Rock, TX, you will direct signal integrity, board-level architecture, and firmware/hardware teams, while managing external semiconductor partnerships and ensuring smooth technology transfer to manufacturing.

You will mentor engineers across firmware and hardware disciplines, drive roadmap directions, and oversee product qualification, cost

Qualifications

• Deep signal integrity expertise at 56G/112G PAM4; channel modeling, insertion/return loss, crosstalk, skew, impedance control.
• Hands-on experience with passive DAC and active copper architectures (AEC/ACC) including retimers and DSP-based designs.
• Experience bringing products through qualification and into volume production with external contract manufacturers.

Responsibilities

• Own copper product portfolio strategy from development through lifecycle management.
• Guide design validation, testing, and qualification for copper products.
• Drive vendor/partner engagement and technical transfer to manufacturing.
• Mentor US-based firmware and hardware teams; align with product management and manufacturing.
• Lead technology roadmaps and ensure compliance with industry standards.

Skills

Signal integrity

PAM4 56G/112G

Board-level architecture

Firmware & hardware leadership

Standards knowledge (IEEE 802.3 / OIF-

Education

BSEE or equivalent

MSEE preferred

Tools

HFSS

ADS

VNA

TDR

BERT

High-bandwidth scope

Job description

Infraeo is seeking a Principal Engineer, High-Speed Copper Technology to lead the full copper portfolio, from strategy to end-of-life. Based onsite in Round Rock, TX, you will direct signal integrity, board-level architecture, and firmware/hardware teams, while managing external semiconductor partnerships and ensuring smooth technology transfer to manufacturing.

You will mentor engineers across firmware and hardware disciplines, drive roadmap directions, and oversee product qualification, cost