Director of Engineering — High-Speed Copper Technology

Infraeo; Round Rock (TX); Sur place; USD 180 000 - 240 000; Plein temps

Résumé du poste

Infraeo is seeking a Director of Engineering, High-Speed Copper Technology, to own the copper portfolio from strategy through qualification, launch, production, and end-of-life. You will build and lead the U.S.

engineering team, define roadmaps, and manage partnerships with semiconductor vendors to ensure on-time delivery of high-performance copper products. You will drive design-for-manufacturability, IP protection, and clean technology transfer while coordinating across the US and Asia.

Qualifications

• 15+ years in high-speed interconnect, cable assembly, or optical/copper transceiver development.
• 5+ years directly managing engineering teams, with hiring and performance management.
• Deep signal integrity expertise at 56G/112G PAM4, with knowledge of 224G PAM4 challenges.
• Experience delivering products through external contract manufacturers and cable houses.
• Experience coordinating firmware and hardware design for FPGA-based systems.

Responsabilités

• Own the full copper product portfolio from strategy through qualification, launch, production, and end-of-life.
• Build and lead the U.S. engineering team, set technology roadmaps, and manage semiconductor partner relationships.
• Provide technical direction for signal integrity, thermal management, materials, components, and board-level architecture.
• Oversee qualification, reliability assessment, and product launch activities with external manufacturing partners.
• Drive IP development and identify opportunities for innovation across the copper-product portfolio.
• Coordinate engineering work across the U.S. and Asia, ensuring on-time delivery and cross-functional collaboration.

Connaissances

Leadership

Signal integrity

Roadmapping

Vendor management

Formation

BSEE or equivalent

MSEE preferred

Outils

CMIS-based interfaces

MSA form factors

IEEE 802.3 standards

Description du poste

Own Infraeo’s full copper portfolio - passive DAC and active AEC/ACC - and build the U.S. engineering team behind it.

About Infraeo

Infraeo Inc. is a global AI cluster connectivity company developing and licensing cutting-edge connectivity technologies and products. Our solutions help customers ship optical transceivers and cable assemblies with superior cost and performance, enabling 400G, 800G, and 1.6T AI cluster networking.

We provide engineering design, IP licensing, field engineering services, and logistics solutions to accelerate the deployment of AI infrastructure worldwide. With a global team across the US and Asia, we serve customers around the world.

About the role

The Director of Engineering, High-Speed Copper Technology owns Infraeo’s full copper portfolio - passive DAC and active AEC/ACC solutions - from technology strategy and product development through qualification, launch, production, and end-of-life.

This role carries both organizational and technical ownership. You will build and lead the U.S. engineering team, set the technology roadmap, own the technical relationship with our semiconductor partners, and be accountable for on‑time delivery of designs that meet performance, cost, and quality targets. Because our designs are licensed and transferred to customers and manufacturing partners rather than built in‑house, design‑for‑manufacturability, defensible IP, and clean technical transfer are core to the job - not downstream concerns. The team is global, spanning the US and Asia, and the role requires working effectively across both. This position is based onsite at our Round Rock, TX office; it is not a remote or hybrid role.

Key responsibilities

Portfolio ownership

• Manage the full portfolio of copper products, passive and active, across technology strategy, product development, qualification, launch, production, and lifecycle management.
• Lead research, development, and product strategy for high‑speed copper technologies and related solutions.
• Establish technology and product roadmaps aligned with business objectives, customer requirements, and industry standards.
• Monitor industry trends, technical standards, competitive developments, and emerging technologies, and translate them into portfolio direction.

Organizational leadership

• Manage and develop the U.S.-based engineering team responsible for firmware development and hardware design - setting technical priorities, allocating resources, mentoring team members, fostering cross‑functional collaboration, and ensuring timely delivery of high‑quality products.
• Own headcount planning, hiring, performance management, and career development for engineering, product‑development, firmware, hardware‑design, and other technical staff.
• Own the engineering budget, including tooling, test equipment, NRE, and third‑party design and validation spend.
• Collaborate with product management, manufacturing, quality, supply chain, sales, and major customers.

Technical direction

• Provide technical direction for signal integrity and transmission performance, thermal management, materials, components, active electronics, firmware, and board‑level architecture.
• Guide design validation, testing, qualification, reliability assessment, and product‑launch activities for passive and active copper products.
• Ensure all products meet applicable performance, reliability, cost, quality, manufacturing, and regulatory requirements.
• Own escalation and resolution of major technical issues across development and production.

Semiconductor & technology partners

• Manage all technical relationships with semiconductor partners from a new‑design perspective: evaluating and selecting semiconductor technologies, defining technical requirements, coordinating architecture and design activities, reviewing partner roadmaps, supporting component qualification, and ensuring alignment between partner capabilities and Infraeo’s product‑development objectives.
• Develop and maintain strong relationships with customers, suppliers, semiconductor partners, technology partners, and relevant industry organizations.

Lifecycle & innovation

• Oversee product lifecycle management: product enhancements, cost optimization, sustaining engineering, end‑of‑life planning, and customer support.
• Support intellectual‑property development and identify opportunities for innovation across the copper‑product portfolio.

Required

• BSEE or equivalent; MSEE preferred.
• 15+ years in high‑speed interconnect, cable assembly, or optical/copper transceiver development, including full‑cycle ownership of products shipped in volume.
• 5+ years directly managing engineering teams, with demonstrated hiring, performance management, and technical career development.
• Deep signal integrity expertise at 56G/112G PAM4, with working knowledge of 224G PAM4 challenges: channel modeling, insertion/return loss, crosstalk, skew, impedance control, and connector/cable launch design.
• Experience across passive DAC and active copper (AEC/ACC) architectures, including retimer, linear redriver, and DSP‑based designs.
• Working command of relevant standards and specifications - IEEE 802.3, OIF-CEI, and applicable MSA form factors (OSFP, QSFP‑DD, QSFP112, QSFP56) - plus CMIS‑based management interfaces.
• Proven track record bringing products through qualification and into volume production with external contract manufacturers and cable assembly houses.
• Demonstrated ability to own a roadmap against business objectives and defend technical trade‑offs to executives and major customers.

Preferred

• Experience managing technical engagements with semiconductor suppliers (DSP, retimer, redriver vendors) from architecture through qualification.
• Familiarity with cable materials and construction - twinax design, dielectric and shielding selection, bonding, and terminations.
• Firmware and embedded systems background sufficient to direct firmware architecture decisions.
• Thermal and mechanical design experience for dense, high‑power pluggable form factors.
• Issued patents or contributions to industry standards bodies.
• Experience supporting hyperscale or Tier‑1 OEM customer qualification programs.
• Experience in a fabless, joint‑design, or IP‑licensing business model, including transferring designs to customers or manufacturing partners.
• Experience leading or coordinating engineering work across US and Asia time zones.

What success looks like

• A credible, customer‑validated copper roadmap covering the current generation and the next speed transition.
• Programs that hit committed launch dates with margin at qualification, not after rework.
• Semiconductor partner selections that hold up over the product’s life - technically and commercially.
• An engineering team that can absorb the next generation without being rebuilt.

Compensation & benefits

Compensation is determined on an individual basis, commensurate with experience and qualifications. Infraeo offers a comprehensive benefits package.

Infraeo Inc. is an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or protected veteran status.