Remote Principal System Architect - High-Speed Interconnects

TE Connectivity Ltd.; United States; Remote; USD 180,000 - 260,000; Full time

Job summary

TE Connectivity Ltd. seeks a Principal System Architect- SI to lead high‑level system architecture for compute, AI, storage and networking. You will engage customers, influence roadmaps, and drive standards participation to keep TE at the forefront of data‑center interconnect solutions.

You will collaborate with cross-functional teams, guide product strategy, and travel 25% to interface with key industry partners and customers, shaping next‑gen interconnect technology.

Qualifications

• Bachelor’s degree in Electrical or Mechanical Engineering, MBA a plus.
• 12 years of electrical engineering work experience and 5+ years in system-level design in datacenter, compute, networking or storage.
• In-depth knowledge of hardware signaling environments and high-speed engineering.
• Ability to communicate technical concepts to diverse audiences and external customers.

Responsibilities

• Serve as primary technical liaison with hyperscalers, OEMs, and system architects to gain insights into compute, AI, storage, and networking challenges.
• Define high-level system architecture requirements aligned with next‑generation compute, AI, and networking ecosystems.
• Drive technology vision and strategy including standards like PCIe, CXL, Ethernet, InfiniBand and AI workloads.
• Collaborate across R&D, product development, and business units to shape roadmaps based on customer challenges and market trends.

Skills

Technical leadership

Customer engagement

System-level design

High-speed interconnects

Standards involvement

Education

Bachelors in Electrical or Mechanical Engineering

MBA

Tools

Simulation tools

Modeling software

CAD tools

Signal integrity analysis

Job description

TE Connectivity Ltd. seeks a Principal System Architect- SI to lead high‑level system architecture for compute, AI, storage and networking. You will engage customers, influence roadmaps, and drive standards participation to keep TE at the forefront of data‑center interconnect solutions.

You will collaborate with cross-functional teams, guide product strategy, and travel 25% to interface with key industry partners and customers, shaping next‑gen interconnect technology.