Senior Co-Design Architect: Power, Thermal & Packaging

NVIDIA Corporation; Santa Clara (CA); Hybrid; USD 196,000 - 368,000; Full time

Benefits offered by this job

Equity

Benefits

Job summary

NVIDIA's Silicon Co-Design Group seeks a senior Co-Design Architect to push the physical limits of chips, spanning architecture, silicon, systems and manufacturing. You won't maintain existing solutions; you'll redefine what's possible and shape GPU/CPU outcomes at scale.

In this role you will identify where power, thermal and packaging constraints will erode competitiveness, and build cross‑domain, testable solutions that deliver next‑generation performance.

Qualifications

• BS/MS/PhD in EE, Physics, or CE (or equivalent experience).
• 12+ years relevant experience.
• Deep understanding of power delivery, thermal dissipation, and current density in high-performance GPU/CPU systems
• Proven ability to convert physical-limit trends into impact, measures and solutions
• Demonstrated cross-functional influence across building, packaging, manufacturing, and test organizations

Responsibilities

• Power, Thermal & Packaging Limits Analysis: Gather and analyze the hard constraints of packaging, power delivery, and thermal dissipation against roadmap demands, predicting when those constraints will reduce competitiveness and acting before they do.
• Cross-Domain Solution Development: Develop solutions that span silicon features, packaging innovation, firmware and hardware co-design, and DFX updates, ensuring future products are not only performant but testable to the highest quality and reliability standards.
• Packaging Technology Evaluation: Assess emerging packaging technologies for their voltage/frequency, noise, reliability, and testability implications, determining which are worth adopting and the trade-offs each choice entails across the full system.
• System-Manufacturing Co-Design: Drive improvements in product performance, performance-per-watt, and provisioning efficiency through system-manufacturing co-design, with the scope to follow the work wherever the highest-impact opportunities lead, whether that's power, thermal, or adjacent domains.

Skills

Power delivery

Thermal management

Cross-functional leadership

Packaging

System-manufacturing co-design

AI modelling for build exploration

GPU/CPU performance

Education

BS/MS/PhD in EE/Physics/CE

Job description

NVIDIA's Silicon Co-Design Group seeks a senior Co-Design Architect to push the physical limits of chips, spanning architecture, silicon, systems and manufacturing. You won't maintain existing solutions; you'll redefine what's possible and shape GPU/CPU outcomes at scale.

In this role you will identify where power, thermal and packaging constraints will erode competitiveness, and build cross‑domain, testable solutions that deliver next‑generation performance.