Senior Cloud IC/SOC Packaging Engineer

Socket.dev; Cupertino (CA); On-site; USD 183,000 - 248,000; Full time

Job summary

Amazon Web Services (AWS) is seeking a Sr. Cloud Hardware Development Engineer (CHDE) with packaging expertise to join our Network Product Development team in Cupertino, CA.

You will design, validate, and sustain IC and SOC packaging for high-speed interconnects at scale, collaborating with design, manufacturing, and cross-functional partners to deliver robust solutions. This role focuses on advancing packaging technologies, test plan automation, and manufacturing yields.

Qualifications

• Bachelor's degree or higher in mechanical/electrical engineering, materials science, or physics.
• 8+ years of IC/SOC packaging design, development, or validation.
• 8+ years of high-speed signal integrity and transmission line theory.
• 2+ years with IC/SOC packaging suppliers, substrate manufacturers, or assembly houses.
• 1+ years of automation scripting using Python, Bash, Shell and/or Matlab.

Responsibilities

• Collaborate with vendors to evaluate packaging technologies and define plans.
• Develop and automate test plans for package characterization including signal integrity, power integrity, and thermal performance.
• Work with vendors/manufacturers in defining and developing test plans for IC/SOC packages, substrates, and interconnect technologies.
• Identify quality issues, improve manufacturing yields, and optimize RMAs for packaged components.

Skills

Signal integrity

Packaging design

Cross-functional collaboration

Education

Bachelor's degree in mechanical/electrical engineering, materials science, or physics

Tools

IC/SOC packaging

Python scripting

Job description

Amazon Web Services (AWS) is seeking a Sr. Cloud Hardware Development Engineer (CHDE) with packaging expertise to join our Network Product Development team in Cupertino, CA.

You will design, validate, and sustain IC and SOC packaging for high-speed interconnects at scale, collaborating with design, manufacturing, and cross-functional partners to deliver robust solutions. This role focuses on advancing packaging technologies, test plan automation, and manufacturing yields.