Senior Cloud Hardware Engineer IC/SOC Packaging & Networking

Amazon Web Services (AWS); Cupertino (CA); On-site; USD 183,000 - 248,000; Full time

Benefits offered by this job

Health insurance

401(k) matching

Paid time off

Parental leave

Job summary

Amazon Data Services, Inc. is seeking a Sr. Cloud Hardware Development Engineer (CHDE) with packaging expertise to join the Network Product Development team in Cupertino, CA. You will design, develop, validate, and sustain IC and SOC packages for high‑speed interconnects powering AWS networks.

You will partner with design, manufacturing, and cross‑functional teams to deliver robust packaging solutions at scale while addressing cost, performance, and reliability requirements.

Qualifications

• Bachelor’s degree or above in mechanical, electrical engineering, materials science, or physics.
• 8+ years of IC/SOC packaging design, development, or validation.
• 8+ years of high‑speed signal integrity, transmission line theory, and package modelling.
• 2+ years with IC/SOC packaging suppliers, substrates, assembly houses, and qualification processes.
• 1+ years automation scripting using Python, Bash, Shell and/or Matlab.

Responsibilities

• Collaborate with vendors/manufacturers to evaluate new packaging technologies and create implementation plans.
• Develop and automate test plans for package characterization including SI, PI, thermal, and mechanical reliability.
• Collaborate with vendors/manufacturers in defining and developing test plans for IC/SOC packages, substrates, and interconnect technologies.
• Work with operations teams to identify quality issues, improve manufacturing yields, and optimize RMA processes for packaged components.

Skills

IC/SOC packaging

Signal integrity

Automation scripting

Python scripting

IC/SOC packaging knowledge

Education

Bachelor’s degree or above in mechanical or electrical engineering, materials science, or physics

Tools

Python

Bash

Matlab

Job description

Amazon Data Services, Inc. is seeking a Sr. Cloud Hardware Development Engineer (CHDE) with packaging expertise to join the Network Product Development team in Cupertino, CA. You will design, develop, validate, and sustain IC and SOC packages for high‑speed interconnects powering AWS networks.

You will partner with design, manufacturing, and cross‑functional teams to deliver robust packaging solutions at scale while addressing cost, performance, and reliability requirements.