Senior CAD Signoff Engineer - AI-Powered SoC EMIR

Apple Inc.

Austin (TX)

On-site

USD 216,000 - 325,000

Full time

5 days ago
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Benefits offered by this job

Stock programs
Employee stock purchase plan
Medical and dental coverage
Tuition reimbursement
Relocation assistance

Job summary

Apple Inc. is seeking a Signoff Engineer in the Silicon Technologies group to design and verify advanced SoC signoff methods for high-performance processors. You will work on gate and transistor level analyses, power and signal EM analysis, and AI/ML-driven signoff optimization.

The role involves collaboration with Design, CAD, and Technology teams to ensure proper EDA tool setups and signoff criteria are met before tapeout, with opportunities for growth within Apple’s technology stack.

Qualifications

  • BS in Electrical Engineering or related field (required).
  • 10+ years of relevant industry experience.
  • Experience with signoff for mixed-signal designs and EMIR analysis.

Responsibilities

  • Define signoff requirements early in the project lifecycle.
  • Collaborate with Design, CAD, and Technology teams to ensure EDA flows are set up.
  • Provide frontline support for enablement, enhancement, and debugging requests.
  • Interface with design groups to ensure signoff criteria are met by project close.

Skills

EMIR analysis
Signoff methodology
CAD flows
Scripting: Python/Perl
CMOS analog mixed-signal design
Excellent communication

Education

BS in Electrical Engineering or related field

Tools

Redhawk
Voltus
Totem

Job description

Apple Inc. is seeking a Signoff Engineer in the Silicon Technologies group to design and verify advanced SoC signoff methods for high-performance processors. You will work on gate and transistor level analyses, power and signal EM analysis, and AI/ML-driven signoff optimization.

The role involves collaboration with Design, CAD, and Technology teams to ensure proper EDA tool setups and signoff criteria are met before tapeout, with opportunities for growth within Apple’s technology stack.

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