Senior BEOL Process Integration Engineer - Hybrid Remote

Kforce Inc; Portland (OR); Hybrid; USD 130,000 - 190,000; Full time

Job summary

Kforce Inc and its client, a growing semiconductor company in Portland, OR, seek a Senior BEOL Process Integration Engineer to support development and manufacturing of advanced IC technologies. This hybrid role partners with Fab Operations and foundries to advance next-generation ICs.

Responsibilities include leading BEOL integration to optimize yield, owning the Cu back-end interconnect sequence, and driving improvements in quality, reliability, and process capability.

Qualifications

• BS or MS in Chemical Engineering, Materials Engineering, Electrical Engineering or related field.
• 5+ years of semiconductor BEOL Process Integration experience.
• Must have been in a BEOL Integration Engineer role and be a subject matter expert.
• 5 years of experience as a process integration engineer in Cu back-end Fab processes.

Responsibilities

• Lead BEOL process integration to optimize product yield and manufacturing performance.
• Perform process integration engineering in a Cu back-end Fab environment (BEOL).
• Own and optimize the complex, multi-step Cu interconnect sequence on wafers.
• Drive improvements in quality, reliability, cost, productivity, and process capability.
• Identify yield-limiting factors and implement corrective actions with cross-functional teams.
• Support technology transfer and process matching with foundry partners.
• Utilize SPC, FDC, DOE, and JMP to analyze data and solve manufacturing challenges.

Skills

BEOL Process Integration

Semiconductor Manufacturing

Data Analysis

Cross-functional Leadership

Communication

Education

BS or MS in Chemical/Materials/Electrical Eng

Tools

SPC

FDC

DOE

JMP

Job description

Kforce Inc and its client, a growing semiconductor company in Portland, OR, seek a Senior BEOL Process Integration Engineer to support development and manufacturing of advanced IC technologies. This hybrid role partners with Fab Operations and foundries to advance next-generation ICs.

Responsibilities include leading BEOL integration to optimize yield, owning the Cu back-end interconnect sequence, and driving improvements in quality, reliability, and process capability.