Backend Process Integration Engineer — Drive Yield & HVM

Intel Corporation; Hillsboro (OR); Hybrid; USD 104,000 - 171,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel Corporation in Hillsboro, OR is seeking a Back End (BE) Process Integration Engineer to define and optimize front-end and back-end flows for new technology nodes. You will coordinate across lithography, etch, deposition, diffusion, wet clean, CMP, dielectric, and metrology teams to drive robust RC performance and reliable margins.

The role includes analyzing yield loss, performing root cause analysis with SPC/DOE/FMEA, establishing process windows, ramping from R&D to high-volume

Qualifications

• PhD in Electrical Engineering, Physics, Applied Physics, Materials Science, Chemical Engineering, Mechanical Engineering, Chemistry, Optics, or a closely related semiconductor field.
• Hands-on cleanroom experience in BEOL integration and interconnect metallization.
• Experience with RC, EM, reliability characterization and cleanroom process development.

Responsibilities

• Develop and define integrated front-end and back-end process flows for new technology nodes.
• Coordinate across lithography, etch, deposition, diffusion, wet clean, CMP, dielectric, and metrology teams.
• Analyze yield loss and parametric failures; perform root cause analysis using SPC/DOE/FMEA.
• Drive corrective actions to improve yield and cycle time; document SOPs.

Skills

JMP

Python

SQL

MATLAB

JSL

TCL

Education

PhD in Electrical Engineering or closely related semiconductor field

Tools

KLA

Applied Materials

Job description

Intel Corporation in Hillsboro, OR is seeking a Back End (BE) Process Integration Engineer to define and optimize front-end and back-end flows for new technology nodes. You will coordinate across lithography, etch, deposition, diffusion, wet clean, CMP, dielectric, and metrology teams to drive robust RC performance and reliable margins.

The role includes analyzing yield loss, performing root cause analysis with SPC/DOE/FMEA, establishing process windows, ramping from R&D to high-volume