Senior BEOL Process Integration Engineer

Kforce Inc; Portland (OR); Hybrid; USD 130,000 - 190,000; Full time

Job summary

Kforce Inc and its client, a growing semiconductor company in Portland, OR, seek a Senior BEOL Process Integration Engineer to support development and manufacturing of advanced IC technologies. This hybrid role partners with Fab Operations and foundries to advance next-generation ICs.

Responsibilities include leading BEOL integration to optimize yield, owning the Cu back-end interconnect sequence, and driving improvements in quality, reliability, and process capability.

Qualifications

• BS or MS in Chemical Engineering, Materials Engineering, Electrical Engineering or related field.
• 5+ years of semiconductor BEOL Process Integration experience.
• Must have been in a BEOL Integration Engineer role and be a subject matter expert.
• 5 years of experience as a process integration engineer in Cu back-end Fab processes.

Responsibilities

• Lead BEOL process integration to optimize product yield and manufacturing performance.
• Perform process integration engineering in a Cu back-end Fab environment (BEOL).
• Own and optimize the complex, multi-step Cu interconnect sequence on wafers.
• Drive improvements in quality, reliability, cost, productivity, and process capability.
• Identify yield-limiting factors and implement corrective actions with cross-functional teams.
• Support technology transfer and process matching with foundry partners.
• Utilize SPC, FDC, DOE, and JMP to analyze data and solve manufacturing challenges.

Skills

BEOL Process Integration

Semiconductor Manufacturing

Data Analysis

Cross-functional Leadership

Communication

Education

BS or MS in Chemical/Materials/Electrical Eng

Tools

SPC

FDC

DOE

JMP

Job description

Responsibilities

Kforce's client, a growing semiconductor company in Portland, OR is seeking a Senior BEOL Process Integration Engineer to support the development and manufacturing of advanced IC technologies. This is a high-impact role working closely with Fab Operations and Foundry partners to improve yield, reliability, and process performance. This role is hybrid remote and an excellent opportunity to join a growing semiconductor organization and play a key role in advancing next‑generation IC technologies.

• Lead BEOL process integration efforts to optimize product yield and manufacturing performance
• Will be performing process integration engineering in a Cu back‑end Fab environment; (Back End Of Line (BEOL) manufacturing phase)
• Will be owning and optimizing the complex, multi‑step sequence used to build microscopic copper electrical interconnects on semiconductor wafers
• Drive improvements in quality, reliability, cost, productivity, and process capability
• Identify yield‑limiting factors and implement corrective actions with cross‑functional engineering teams
• Support technology transfer and process matching with foundry partners
• Utilize SPC, FDC, DOE, and JMP to analyze data and solve complex manufacturing challenges

Requirements

• BS, or MS degree in Chemical Engineering, Materials Engineering, Electrical Engineering or related field
• At least 5+ years or more of semiconductor BEOL Process Integration experience
• At least 5 years of semiconductor BEOL process integration engineering experience; Must have been in a BEOL Integration Engineer role; Will be the subject matter expert; Must be able to hit the ground running
• 5 years of experience being an actual process integration engineer in a Cu back‑end Fab process; (Back End Of Line (BEOL) manufacturing phase)
• As a BEOL Process Integration Engineer, must have strong work experience with the following process modules such as: Photo, Etch, Thin Films, and CMP
• Strong experience owning and optimizing the complex, multi‑step sequence used to build microscopic copper electrical interconnects on semiconductor wafers
• Strong experience looking at the entire end‑to‑end interconnect flow
• Experience partnering with Process and Yield Engineering teams to improve fab performance
• Hands‑on experience with SPC, FDC, DOE, and JMP
• Strong knowledge of Photolithography, Etch, Thin Films, and CMP processes
• Proven background transferring technologies from R&D into high‑volume manufacturing
• Strong communication, leadership, and teamwork skills

The pay range is the lowest to highest compensation we reasonably in good faith believe we would pay at posting for this role. We may ultimately pay more or less than this range. Employee pay is based on factors like relevant education, qualifications, certifications, experience, skills, seniority, location, performance, union contract and business needs. This range may be modified in the future.

We offer comprehensive benefits including medical/dental/vision insurance, HSA, FSA, 401(k), and life, disability & ADD insurance to eligible employees. Salaried personnel receive paid time off. Hourly employees are not eligible for paid time off unless required by law. Hourly employees on a Service Contract Act project are eligible for paid sick leave.

Note: Pay is not considered compensation until it is earned, vested and determinable. The amount and availability of any compensation remains in Kforce's sole discretion unless and until paid and may be modified in its discretion consistent with the law.

This job is not eligible for bonuses, incentives or commissions.

Kforce is an Equal Opportunity/Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, pregnancy, sexual orientation, gender identity, national origin, age, protected veteran status, or disability status.