Package Design Engineer

Broadcom; Fort Collins (CO); On-site; USD 141,000 - 226,000; Full time

Job summary

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages supporting high-speed SerDes and high-power delivery for AI, networking, HPC, and 5G base stations.

You will design and optimize flip-chip BGA packages, oversee schedules across multiple projects, and work with global teams to improve efficiency and reliability.

Qualifications

• Bachelor of Science in Electrical Engineering or related field, with strong emphasis on high-speed packaging.
• Experience in flip-chip BGA package design including SerDes or high-speed signaling is required.
• Knowledge of SI/PI at package level and practical application to package designs.
• Must work well with global teams across time zones.

Responsibilities

• Own ASIC package designs focusing on signal integrity, power integrity, manufacturability, reliability and thermal aspects.
• Develop package designs for SerDes, ADC/DAC, DDR, etc.
• Plan and track work across multiple projects.
• Perform general flip-chip BGA package design and engineering tasks.
• Interface with customers and manage design projects.

Skills

Signal integrity

Power integrity

Cadence APD (Allegro)

Cadence SKILL

Design automation coding

Self-management

Team collaboration

Education

BSEE or similar field

MSEE or similar field

Tools

Cadence APD/Allegro

Cadence SKILL

Job description

USA-CA San Jose Innovation Drive

USA-TX-Austin - River Place B7

USA-Colorado-Fort Collins-4380 Ziegler Road

Full time

R024439

Job Description:

Broadcom is seeking an experienced IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 224G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design, and contribute to efficiency improvements for our design team.

RESPONSIBILITIES:

• Overall design responsibility for ASIC package designs, including aspects of signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts.

• Package Design of critical structures for SerDes, ADC/DAC, DDR, etc.

• Schedule, prioritize, & track your work across 2+ projects simultaneously

• General flip-chip BGA package design & engineering

• Project management and customer interface for your design projects

• Contribute to efficiency improvements for the design team, through process development/improvement, automation, documentation, etc.

• Physical design (layout) is a foundational responsibility in this role

EDUCATION/EXPERIENCE & REQUIREMENTS:

• BSEE or similar field and 12+ years’ experience in flip-chip-BGA package design, including high-speed SerDes or MSEE or similar field and 10+ years’ work experience

• Knowledge of package-level signal integrity and power integrity, to apply to package designs

• Cadence APD (allegro package designer) experience is preferred. Equivalent tool is OK.

• Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers

• Self-management and organization skills

• Preferred candidates will also have 1 or more years experience with Cadence SKILL for Allegro, or similar design-automation coding experience and interest

OTHER REQUIREMENTS

• This job requires working on-site at the Broadcom office, 5 days a week. This is not a remote-work position

Additional Job Description:

Compensation and Benefits

The annual base salary range for this position is $141,300 - $226,000.

This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.

Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Welcome! Thank you for your interest in Broadcom!

We are a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions.

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