Senior Applications Engineer - Lithography & Data Lead

ASML Berlin GmbH; Hillsboro (OR); Sur place; USD 120 000 - 180 000; Plein temps

Avantages offerts par ce poste

Health insurance

401k plan

Paid vacation

Paid holidays

Résumé du poste

ASML in Hillsboro, Oregon, is seeking a Senior Applications Engineer to lead system performance escalations and act as a technical lead in driving time-to-containment improvements for an advanced node in the US region.

You will work with cross-functional teams to translate customer on-product issues into lithography or metrology problems, drive project workstreams, and present findings to stakeholders.

Qualifications

• Advanced degree/work experience in lithography/metrology is required.
• Experience with data analysis tools (MATLAB or Python) is essential.
• Strong stakeholder management and project leadership skills.

Responsabilités

• Lead/co-lead projects for new systems introduction and VHV transitions.
• Own workstreams, develop project plans, and report progress to stakeholders.
• Support troubleshooting and escalation for on-product issues.
• Translate customer issues into lithography/metrology problem statements.
• Define customer experiments and data analyses to prove ASML value.
• Meet stakeholders to maintain alignment and inform progress.
• Prepare technical presentations for customers and assist sales.
• Define customer requirements for existing/evaluation products.
• Guide junior engineers and collaborate with project teams.

Connaissances

Leadership

Communication

Interpersonal skills

Project management

Problem solving

Quick learner

Stakeholder mgmt

Formation

Master's degree or PhD in a technical discipline

8+ years IC manufacturing lithography/metrology

5+ years data analysis with MATLAB or Python

5+ years stakeholder and change management

5 years data analysis and presenting findings

3+ years project management methodologies

Description du poste

ASML in Hillsboro, Oregon, is seeking a Senior Applications Engineer to lead system performance escalations and act as a technical lead in driving time-to-containment improvements for an advanced node in the US region.

You will work with cross-functional teams to translate customer on-product issues into lithography or metrology problems, drive project workstreams, and present findings to stakeholders.