Senior AI Deployment Lead for Chip Design

Cadence Design Systems, Inc.; Cary (NC); On-site; USD 150,000 - 230,000; Full time

Job summary

Cadence Design Systems, Inc. is hiring a Principal AI Forward Deployment Engineer to embed with strategic semiconductor customers and operationalize Cadence's AI tooling across silicon design flows.

You will lead end-to-end deployment of AI/LLM-powered solutions into RTL, DV, PD, and signoff stages, turning AI-enabled workflows into measurable productivity gains while collaborating with Cadence R&D and customer teams at customer sites.

Qualifications

• Extensive hands-on semiconductor/chip design across RTL, DV, CAD, tape-outs.
• Proven ability to apply AI/LLM tools to engineering tasks and automation.
• Strong customer-facing communication and field deployment leadership.
• Willingness to be on-site with customers and relocate if needed.

Responsibilities

• Lead end-to-end deployment of Cadence AI/LLM-powered solutions into customer silicon design flows.
• Architect agentic workflows, prompt strategies, and RAG pipelines for EDA tasks.
• Map customer methodology onto Cadence AI building blocks and reference flows.
• Define KPIs and report ROI from pilot to production across sites.
• Serve as trusted technical advisor, running design reviews and roadmaps.
• Guide IT/Sec on secure LLM access and deployment considerations.

Skills

Semiconductor design

AI/LLM deployment

Customer-facing communication

Education

BS/MS/PhD in EE, ECE, CS, or related

Tools

Cadence AI tooling

Agent-based workflows

GPU/inference planning

Job description

Cadence Design Systems, Inc. is hiring a Principal AI Forward Deployment Engineer to embed with strategic semiconductor customers and operationalize Cadence's AI tooling across silicon design flows.

You will lead end-to-end deployment of AI/LLM-powered solutions into RTL, DV, PD, and signoff stages, turning AI-enabled workflows into measurable productivity gains while collaborating with Cadence R&D and customer teams at customer sites.