Process Engineer

Lumicity; San Francisco (CA); On-site; USD 90,000 - 120,000; Full time

Job summary

A semiconductor manufacturing company is seeking a hands-on Process Engineer in San Francisco, California, to develop and sustain wafer fabrication processes. The ideal candidate will have 2-5 years of experience, strong analytical skills, and a degree in a related field. The role requires direct involvement in advanced manufacturing settings, necessitating a strong background in plasma etching and deposition. This position involves collaboration with cross-functional teams to enhance yield and throughput.

Qualifications

• 2 to 5+ years of hands-on semiconductor manufacturing or process engineering experience.
• Strong background in wafer fab process development and sustaining.
• Direct experience with plasma etch and/or plasma deposition.

Responsibilities

• Develop, optimize, and sustain wafer fabrication processes.
• Drive hands-on processing in areas such as photolithography and dry etch.
• Support wafer level processing steps including thinning and cleaving.

Skills

Wafer fabrication process development

Problem solving

Statistical analysis

Communication

Education

Bachelor’s or Master’s degree in Chemical Engineering, Electrical Engineering, Materials Science, or related discipline

Tools

JMP

Python

Job description

We are seeking a hands on Process Engineer to join an advanced semiconductor manufacturing environment focused on developing and sustaining complex wafer fabrication processes. This role is ideal for someone who enjoys working directly in the fab, owning processes end to end, and solving challenging manufacturing problems in a fast paced, technology driven setting.

What you will be doing

• Develop, optimise, and sustain wafer fabrication processes across multiple front end manufacturing steps
• Drive hands on processing in areas such as photolithography, wet chemical processing, dry etch, and thin film deposition
• Own and improve plasma based processes, including plasma etch (RIE, ICP) and or plasma deposition (PECVD, ALD, or related techniques)
• Support wafer level processing steps including thinning, scribing, cleaving, and coatings
• Apply SPC, DOE, and statistical analysis to build stable, repeatable, and scalable processes
• Perform on wafer testing, metrology, and failure analysis using tools such as SEM, FIB, EDS, AFM, and similar techniques
• Lead or support out of control responses using structured problem solving methodologies
• Partner closely with equipment engineering, technicians, and cross functional teams to improve yield, reliability, and throughput
• Contribute to technical reviews, documentation, and reporting to project teams and leadership

What we are looking for

• Bachelor’s or Master’s degree in Chemical Engineering, Electrical Engineering, Materials Science, or a related discipline
• 2 to 5 plus years of hands on semiconductor manufacturing or process engineering experience
• Strong background in wafer fab process development and sustaining
• Direct experience with plasma etch and or plasma deposition is required
• Experience working in a cleanroom environment and running tools independently
• Strong analytical and problem solving skills with experience using statistical or data analysis tools such as JMP, R, or Python
• Comfortable working in a small, agile team and taking ownership of multiple responsibilities
• Clear communicator who works well across engineering, operations, and leadership teams
• On site role at a semiconductor wafer fabrication facility in Fremont, California
• Hands on presence in the fab is required
• Role is subject to US export control requirements and therefore requires US person status