Semiconductor Packaging Quality Engineer: Component Integrity

020 Cisco Systems, Inc.; San Jose (CA); On-site; USD 155,000 - 259,000; Full time

Job summary

Cisco Systems, Inc. is seeking a detail-oriented Semiconductor Packaging Component Quality Engineer to ensure top component integrity across packaging types.

You will evaluate packaged components from external suppliers and lead board-level reliability efforts for SMT manufacturing and long-term performance. The role requires 4+ years in semiconductor quality or related failure analysis, plus strong JEDEC/IPC knowledge.

Qualifications

• Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or related field.
• 4+ years of experience in semiconductor quality, packaging reliability, or board-level failure analysis.
• Strong understanding of standard IC packaging types (e.g., BGA, QFN, WLCSP, Flip-Chip) and their stress behaviors.
• Strong working knowledge of JEDEC and IPC standards regarding packaging, reliability testing, and board-level qualifications.

Responsibilities

• Component Packaging Evaluation: assess and lead quality and physical integrity of incoming packaged components from external suppliers.
• Board-Level Reliability: review data or perform BLR/L2 testing to ensure component-to-board interconnect integrity for SMT manufacturing and long-term use.
• Failure Analysis: oversee root-cause analysis on component failures, identifying package-level defects.
• Vendor Quality Management: audit packaging processes with external suppliers and OSATs; review reliability data; resolve excursions.
• Change Assessment: evaluate supplier-driven package process changes (PCNs) for alignment with internal standards.

Skills

Packaging quality

Board-level testing

Root-cause analysis

Vendor quality

Component reliability

Education

Bachelor's degree

Tools

Reliasoft

Weibull++

Minitab

JMP

Allegro

Altium

Job description

Cisco Systems, Inc. is seeking a detail-oriented Semiconductor Packaging Component Quality Engineer to ensure top component integrity across packaging types.

You will evaluate packaged components from external suppliers and lead board-level reliability efforts for SMT manufacturing and long-term performance. The role requires 4+ years in semiconductor quality or related failure analysis, plus strong JEDEC/IPC knowledge.