Semiconductor Packaging Engineer – Design & Reliability

Analog Devices, Inc.; Los Angeles (CA); On-site; USD 75,000 - 103,000; Full time

Benefits offered by this job

Medical, vision and dental coverage

401k

Paid vacation and holidays

Job summary

Analog Devices, Inc. in Los Angeles is seeking a packaging development engineer to lead advanced semiconductor packaging programs, including wire-bond, flip-chip, and system‑in‑package solutions.

You will collaborate with cross‑functional teams to balance reliability, manufacturability, and cost while driving design excellence. Qualifications include a Master’s in Mechanical or Electrical Engineering and 2+ years in packaging development, with experience in ANSYS, FloTHERM, Sigrity, or Icepak,

Qualifications

• Master’s degree in Mechanical or Electrical Engineering.
• 2+ years in semiconductor packaging development, package simulation, or packaging manufacturing.
• Strong understanding of IC packaging materials and their mechanical, thermal, and electrical behaviours.
• Knowledge of IC package structures, substrate technologies, and assembly processes.
• Experience with ANSYS, FloTHERM, Sigrity, or Icepak is a plus; CAD tools are desirable.
• Strong analytical, problem-solving, and cross-functional collaboration skills.

Responsibilities

• Lead the design, development, and qualification of semiconductor packaging solutions (wire-bond, flip-chip, SIP, module-based).
• Provide technical leadership in mechanical and thermal analysis to guide architecture and reliability.
• Collaborate with cross-functional teams to define requirements and resolve complex issues.
• Work with OSAT partners, substrates and material vendors to improve yield and processes.
• Develop and maintain design guidelines, specifications, simulations, and technical docs.

Skills

Semiconductor packaging

Package simulation

Packaging manufacturing

Education

Master’s degree in Mechanical or Electrical Engineering

Tools

ANSYS

FloTHERM

Sigrity

Icepak

SolidWorks

AutoCAD

Job description

Analog Devices, Inc. in Los Angeles is seeking a packaging development engineer to lead advanced semiconductor packaging programs, including wire-bond, flip-chip, and system‑in‑package solutions.

You will collaborate with cross‑functional teams to balance reliability, manufacturability, and cost while driving design excellence. Qualifications include a Master’s in Mechanical or Electrical Engineering and 2+ years in packaging development, with experience in ANSYS, FloTHERM, Sigrity, or Icepak,