Engineer, Semi Packaging Engineering

Analog Devices, Inc.; Los Angeles (CA); On-site; USD 75,000 - 103,000; Full time

Benefits offered by this job

Medical, vision and dental coverage

401k

Paid vacation and holidays

Job summary

Analog Devices, Inc. in Los Angeles is seeking a packaging development engineer to lead advanced semiconductor packaging programs, including wire-bond, flip-chip, and system‑in‑package solutions.

You will collaborate with cross‑functional teams to balance reliability, manufacturability, and cost while driving design excellence. Qualifications include a Master’s in Mechanical or Electrical Engineering and 2+ years in packaging development, with experience in ANSYS, FloTHERM, Sigrity, or Icepak,

Qualifications

• Master’s degree in Mechanical or Electrical Engineering.
• 2+ years in semiconductor packaging development, package simulation, or packaging manufacturing.
• Strong understanding of IC packaging materials and their mechanical, thermal, and electrical behaviours.
• Knowledge of IC package structures, substrate technologies, and assembly processes.
• Experience with ANSYS, FloTHERM, Sigrity, or Icepak is a plus; CAD tools are desirable.
• Strong analytical, problem-solving, and cross-functional collaboration skills.

Responsibilities

• Lead the design, development, and qualification of semiconductor packaging solutions (wire-bond, flip-chip, SIP, module-based).
• Provide technical leadership in mechanical and thermal analysis to guide architecture and reliability.
• Collaborate with cross-functional teams to define requirements and resolve complex issues.
• Work with OSAT partners, substrates and material vendors to improve yield and processes.
• Develop and maintain design guidelines, specifications, simulations, and technical docs.

Skills

Semiconductor packaging

Package simulation

Packaging manufacturing

Education

Master’s degree in Mechanical or Electrical Engineering

Tools

ANSYS

FloTHERM

Sigrity

Icepak

SolidWorks

AutoCAD

Job description

Come join Analog Devices (ADI) – a place where Innovation meets Impact. For more than 55 years, Analog Devices has been inventing new breakthrough technologies that transform lives. At ADI you will work alongside the brightest minds to collaborate on solving complex problems that matter from autonomous vehicles, drones and factories to augmented reality and remote healthcare.

ADI fosters a culture that focuses on employees through beneficial programs, aligned goals, continuous learning opportunities, and practices that create a more sustainable future.

About Analog Devices

Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at www.analog.com and on LinkedIn and X.

This role will be responsible for the development of advanced packaging solutions for semiconductor devices across various market segments. The packaging solutions must meet demanding product requirements while balancing reliability, manufacturability, and cost. Candidates will be expected to:

• Lead the design, development, and qualification of semiconductor packaging solutions, including wire-bond, flip-chip, system-in-package, and module-based products.
• Provide technical leadership in package mechanical and thermal analysis to support package architecture selection, design optimization, and reliability risk assessment.
• Work closely with cross-functional teams to understand product and packaging requirements, identify customer needs, and resolve complex technical issues.
• Collaborate with OSAT partners, substrate suppliers, and material vendors to resolve technical issues, drive process development, optimize manufacturing processes, and improve yield.
• Work with quality and reliability teams to establish reliability criteria and qualification plans for semiconductor products across various market applications.
• Develop and maintain package design guidelines, process specifications, simulation methodologies, and technical documentation.

Qualifications

• Master’s degree in Mechanical Engineering or Electrical Engineering.
• 2+ years of hands-on experience in semiconductor packaging development, package simulation, or packaging manufacturing.
• Strong understanding of IC packaging materials and their mechanical, thermal, and electrical behaviors.
• Strong knowledge of IC package structures, substrate technologies, and semiconductor assembly processes.
• Experience with ANSYS, FloTHERM, Sigrity, or Icepak is a plus.
• Experience with SolidWorks or AutoCAD is a plus.
• Strong analytical, problem-solving, communication, and collaboration skills.
• Ability to work effectively in cross-functional teams and influence technical decisions across organizations.

For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.

Analog Devices is an equal opportunity employer. We foster a culture where everyone has an opportunity to succeed regardless of their race, color, religion, age, ancestry, national origin, social or ethnic origin, sex, sexual orientation, gender, gender identity, gender expression, marital status, pregnancy, parental status, disability, medical condition, genetic information, military or veteran status, union membership, and political affiliation, or any other legally protected group.

EEO is the Law: Notice of Applicant Rights Under the Law.

The expected wage range for a new hire into this position is $75,200 to $103,400.

• Actual wage offered may vary depending on work location, experience, education, training, external market data, internal pay equity, or other bona fide factors.
• This position qualifies for a discretionary performance-based bonus which is based on personal and company factors.
• This position includes medical, vision and dental coverage, 401k, paid vacation, holidays, and sick time, and other benefits.