RFIC Packaging Designer – High‑Freq GaN/SiP, Onsite Atlanta

Falcomm; Atlanta (GA); On-site; USD 90,000 - 140,000; Full time

Benefits offered by this job

Equity package

Health insurance

401(k) plan

Paid time off

Job summary

Falcomm seeks an IC Packaging Designer to advance RFIC packaging solutions for high-frequency performance and manufacturability. You will design and optimize packages, layouts, and substrates, collaborating with RFIC designers, layout engineers, and manufacturing partners to enable production-ready integration.

Ideal candidates have 3–5 years in RFIC packaging up to 50 GHz, experience with wirebond/flip-chip/PoP/SiP, and proficiency in major packaging tools, with full-time onsite work in

Qualifications

• 3–5 years of experience designing RFIC semiconductor packages up to 50 GHz.
• Experience with wirebond, flip-chip, PoP, or SiP packaging.
• Proficiency with Cadence Allegro APD/SiP or Mentor Xpedition.

Responsibilities

• Design RFIC packages and substrates optimized for high-frequency performance.
• Create package layouts, bond diagrams, and substrate routing using packaging EDA tools.
• Collaborate with SI/EM/thermal teams to validate package performance.
• Produce documentation, fabrication drawings, and assembly specs.
• Contribute to design reviews, prototyping, and failure analysis to improve RF performance and yield.
• Co-optimize chip and package performance with RFIC designers to minimize parasitics.
• Support PCB integration to ensure system-level RF performance.
• Coordinate with fabrication and assembly partners.

Skills

RF packaging

High-frequency design

Signal integrity

Education

Bachelor’s degree in Electrical Engineering or related discipline

Tools

Cadence Allegro APD/SiP

Mentor Xpedition

HFSS

Q3D

PowerSI

CAM350

Valor

Calibre

Ansys Electronics Desktop

Icepak

Job description

Falcomm seeks an IC Packaging Designer to advance RFIC packaging solutions for high-frequency performance and manufacturability. You will design and optimize packages, layouts, and substrates, collaborating with RFIC designers, layout engineers, and manufacturing partners to enable production-ready integration.

Ideal candidates have 3–5 years in RFIC packaging up to 50 GHz, experience with wirebond/flip-chip/PoP/SiP, and proficiency in major packaging tools, with full-time onsite work in