Research Engineer II - Thermal Modeling & Microcooling

Georgia Institute of Technology; Atlanta (GA); On-site; USD 85,000 - 110,000; Full time

Job summary

Georgia Tech's School of Electrical and Computer Engineering seeks a Research Engineer II to support modeling, fabrication, and measurement of advanced cooling solutions for 2.5D and 3D architectures. The role emphasizes thermal modeling with commercial tools and hands-on cleanroom activities.

Ideal candidates will have DRIE/TSV fabrication experience, chip bonding skills, and lab-ready expertise in thermal characterization to advance packaging research at Georgia Tech in Atlanta.

Qualifications

• Master's degree in a related field with 3+ years of relevant full-time experience.
• Experience with thermal modeling using commercial software and lab characterization.
• Cleanroom fabrication skills including silicon DRIE and TSV fabrication.

Responsibilities

• Support modeling, simulation, fabrication, process integration, and measurement of advanced cooling solutions.
• Collaborate with ECE teams and external labs to advance 2.5D/3D architectures.

Skills

Thermal modeling

Cleanroom fabrication

DRIE

TSV fabrication

Chip bonding

Education

Master's degree in related area

Doctoral degree

Tools

DRIE

Through-silicon via fabrication

Wafer bonding

Job description

Georgia Tech's School of Electrical and Computer Engineering seeks a Research Engineer II to support modeling, fabrication, and measurement of advanced cooling solutions for 2.5D and 3D architectures. The role emphasizes thermal modeling with commercial tools and hands-on cleanroom activities.

Ideal candidates will have DRIE/TSV fabrication experience, chip bonding skills, and lab-ready expertise in thermal characterization to advance packaging research at Georgia Tech in Atlanta.