Mechanical Engineer, Opto-Mechanical & Thermal Design

Georgia Tech Research Institute; Atlanta (GA); On-site; USD 90,000 - 130,000; Full time

Job summary

The Georgia Tech Research Institute (GTRI) seeks a Mechanical Engineer to lead development of advanced ME/micro-mechanical systems. You will ideate, analyze, design, simulate, manufacture, and test components, subsystems, and full assemblies supporting ISR, LIDAR, and remote sensing domains.

Collaborate across disciplines and guide prototypes to deployment. Responsibilities include packaging, power and thermal management, and creating data packages for project teams.

Qualifications

• 4+ years using Solidworks for mechanical packaging and assemblies.
• 4+ years in CFD/FEA, opto-mechanical analyses, or thermal analyses.
• Familiar with GD&T and manufacturing technologies.
• 4+ years generating ANSI ISO level 2/3 drawings.
• Hands-on experience with machine shop tools and prototyping.
• Ability to lead projects and teams; TS/SCI clearance desirable

Responsibilities

• Manage complex mechanical packaging tasks and integration with sensors.
• Conduct design studies and requirements analysis for ME systems.
• Perform thermal, vibration, shock, and reliability testing per MIL/ANSI/ASME.
• Lead preparation of technical data packages and drawings.
• Model designs in 2D/3D and translate requirements to architectures.
• Oversee fabrication of prototypes and assist with team mentoring.

Skills

Solidworks

GD&T

Thermal analyses

CFD/FEA (ANSYS Icepak)

Opto-mechanical analyses

Prototype development

Python/MATLAB/C/C++

Project leadership

Machining tools experience

Education

Bachelor’s degree in Aerospace Eng / Systems Eng / Mechanical Eng

Master’s degree in related field

Ph.D. in related field

Tools

ANSYS Icepak

Job description

The Georgia Tech Research Institute (GTRI) seeks a Mechanical Engineer to lead development of advanced ME/micro-mechanical systems. You will ideate, analyze, design, simulate, manufacture, and test components, subsystems, and full assemblies supporting ISR, LIDAR, and remote sensing domains.

Collaborate across disciplines and guide prototypes to deployment. Responsibilities include packaging, power and thermal management, and creating data packages for project teams.