Remote RFIC Design Engineer – CMOS/SoI mmWave Expert

BeRex

Santa Ana (CA)

Remote

USD 120,000 - 180,000

Full time

9 hours ago
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Job summary

BeRex is seeking an embedded RF IC Design Engineer to lead hands-on design and verification of RF front-end blocks (Switches, PA, LNA, Bandgap) in CMOS/SOI/BiCMOS processes. You’ll model, simulate, and help optimize performance in collaboration with a team, with layout and post-layout responsibilities.

Experience across product cycles from concept to mass production is preferred. The role involves EM modeling for packaging/PCB and close work with design engineers to reach high-volume production

Qualifications

  • Thorough knowledge of CMOS, SOI, and BiCMOS processes.
  • Design experience in CMOS analog/RFIC blocks above 1GHz.
  • Proficient with EDA tools on Linux/Unix.
  • Product development experience from concept to mass production preferred.
  • Solid fundamentals in PA, LNA, switches and related blocks.

Responsibilities

  • Design and simulate RF frontend blocks (Switches, PA, LNA, Bandgap).
  • Hands-on circuit design, modeling, and verification across CMOS/SOI/BiCMOS.
  • Layout participation, DRC/LVS, and post-layout optimization.
  • EM modeling for packaging and PCB at block and system levels.
  • Collaborate to optimize LNA NF, PA efficiency, linearity, ACPR/EVM.
  • Lead/participate in silicon evaluation towards high-volume production.

Skills

CMOS RF design
SOI/BiCMOS knowledge
LNA/PA design
RF front-end blocks
High-speed/BW op-amps

Education

MSEE or BSEE
PhD preferred

Tools

ADS
Momentum
HFSS
Cadence Spectre / SpectreRF / GoldenGate

Job description

BeRex is seeking an embedded RF IC Design Engineer to lead hands-on design and verification of RF front-end blocks (Switches, PA, LNA, Bandgap) in CMOS/SOI/BiCMOS processes. You’ll model, simulate, and help optimize performance in collaboration with a team, with layout and post-layout responsibilities.

Experience across product cycles from concept to mass production is preferred. The role involves EM modeling for packaging/PCB and close work with design engineers to reach high-volume production

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