R&D Hardware Engineer - High-Speed SerDes & Power

Broadcom; San Jose (CA); On-site; USD 101,000 - 162,000; Full time

Benefits offered by this job

Discretionary annual bonus

Equity grants

401(k) with company match

Medical, dental & vision plans

Paid holidays & leave

Job summary

Broadcom in San Jose is seeking a Hardware Engineer to design, develop, and deliver ultra high-performance electronic products. You will own all EE hardware design aspects, including BOM creation, vendor negotiation, circuit/board design, development, and validation.

You will collaborate with Hardware, ASIC, Signal, Mechanical, Thermal, Diagnostic, Packaging, and Manufacturing teams, with potential joint programs across partner groups. A strong 5+ years EE background is required.

Qualifications

• Bachelor's degree in electrical engineering with 5+ years of related experience.
• Experience with large high-powered SOCs and advanced packaging.
• Proficiency with 112G–224G SerDes signaling.
• Understanding of power and thermal issues on PCBs with 1kW+ footprints.
• Collaborative cross-functional team experience.

Responsibilities

• Own all aspects of EE hardware design from BOM to validation.
• Lead design, development, and delivery of ultra high-performance products.
• Support customer trials, field issues, and sustaining.
• Participate in cross-functional programs with Sales, Marketing, Purchasing, Manufacturing, etc.
• Provide technical leadership to a small design team.

Skills

High-speed signaling

Power/thermal analysis

Cross-functional teamwork

Lifecycle ownership

Vendor negotiation

Education

Bachelor's in EE

Tools

Oscilloscopes

Vector analyzers

PCB design tools

Validation tools

Job description

Broadcom in San Jose is seeking a Hardware Engineer to design, develop, and deliver ultra high-performance electronic products. You will own all EE hardware design aspects, including BOM creation, vendor negotiation, circuit/board design, development, and validation.

You will collaborate with Hardware, ASIC, Signal, Mechanical, Thermal, Diagnostic, Packaging, and Manufacturing teams, with potential joint programs across partner groups. A strong 5+ years EE background is required.