Principal Hardware Engineer - Lead High-Perf SOC & PCB

Broadcom; San Jose (CA); On-site; USD 144,000 - 230,000; Full time

Benefits offered by this job

Medical, dental and vision plans

401(K) participation including company

Employee Stock Purchase Program (ESPP)

Employee Assistance Program (EAP)

company paid holidays

paid sick leave and vacation time

Paid Family Leave and other leaves of

Job summary

Broadcom is seeking a Principal Hardware Engineer in San Jose to lead a design team delivering ultra-high-performance electronic products. You will own all EE hardware design aspects, from BOM to validation, guide customers through trials, and drive a One Person One Board culture.

A strong background in SOC placement and PCB design is essential. You will collaborate with Hardware, ASIC, Signal, Mechanical, Thermal, and Manufacturing teams, while engaging with partner engineering groups at

Qualifications

• Placement of large high-powered SOCs based on advanced silicon and packaging process technologies, including 2D, 2.5D, and 2.5D with 3D memories.
• Deep understanding and experience in PCB board layout.
• Lifecycle product ownership of complex products, from inception to volume production within cross-functional teams.
• Work with support groups including Sales, Marketing, Purchasing, Manufacturing, Customer Support, Compliance, Safety, and Sustainability.
• Bachelor's degree in electrical engineering and 12+ years of related experience.

Skills

SOC placement

PCB layout

Cross-functional teamwork

Product ownership

Education

Bachelor's degree in Electrical Engineering

12+ years of related experience

Job description

Broadcom is seeking a Principal Hardware Engineer in San Jose to lead a design team delivering ultra-high-performance electronic products. You will own all EE hardware design aspects, from BOM to validation, guide customers through trials, and drive a One Person One Board culture.

A strong background in SOC placement and PCB design is essential. You will collaborate with Hardware, ASIC, Signal, Mechanical, Thermal, and Manufacturing teams, while engaging with partner engineering groups at