R&D Engineering Intern — Housing Stipend & 401(k)

Cook Medical Inc.

Bloomington (IN)

On-site

USD 25,000 - 33,000

Part time

6 days ago
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Benefits offered by this job

Housing stipend
401(k)
Fitness center access
Learning events
Capstone presentation

Job summary

Cook Polymer Technology in Bloomington, IN is offering a paid Summer 2027 R&D Engineering Internship. This 12-week rotation provides real-world experience in medical device manufacturing, a direct mentor, and exposure to projects across the R&D engineering spectrum.

Interns receive a housing stipend, participate in learning events, and present a capstone project. Eligible students are entering their junior or senior year (or graduate students) with a minimum GPA of 3.0 and proof of enrollment.

Qualifications

  • Interest in a Life Sciences career and ability to work with others
  • Candidates should be entering Junior/Senior year or graduate school for the fall semester
  • Minimum GPA of 3.0 preferred
  • Enrollment proof (including pre-registration for the fall) is required for consideration

Responsibilities

  • Utilize engineering knowledge to produce project deliverables/documents
  • Adhere to QMS, OSHA/FDA and ISO 13485 requirements
  • Maintain all training requirements for the position
  • Interact effectively with colleagues across the global organization
  • Strictly adhere to safety requirements
  • Maintain regular and punctual attendance
  • Uphold company quality and quantity standards
  • Communicate effectively in collaborative and independent work situations
  • Remain calm and receptive in fast-paced situations

Skills

Life Sciences interest
Teamwork
Communication
Safety minded

Education

Junior/Senior year or grad student
GPA 3.0+ preferred
Enrollment proof required

Job description

Cook Polymer Technology in Bloomington, IN is offering a paid Summer 2027 R&D Engineering Internship. This 12-week rotation provides real-world experience in medical device manufacturing, a direct mentor, and exposure to projects across the R&D engineering spectrum.

Interns receive a housing stipend, participate in learning events, and present a capstone project. Eligible students are entering their junior or senior year (or graduate students) with a minimum GPA of 3.0 and proof of enrollment.

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