Quantum Interposer Engineering Lead

Hakkōda, an IBM Company

Town of Yorktown (NY)

On-site

USD 180,000 - 240,000

Full time

20 hours ago
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Job summary

IBM Research in Yorktown Heights seeks a Quantum Interposer Technologist to lead silicon spin interposer technology development, process architecture, and manufacturing strategy, ensuring delivery of advanced interposer solutions.

You will guide wafer fabrication, finishing, multilayer integration, and cryogenic packaging, partnering with design teams and external partners to align on materials, RF constraints, and long‑range roadmaps.

Qualifications

  • Expert level understanding of silicon spin superconducting device fabrication, integration, and cryogenic system development.
  • Experience with facilities planning, capital equipment, and long‑term technology road mapping.
  • Ability to lead cross‑functional engineering teams and communicate strategies to senior leadership.

Responsibilities

  • Act as subject matter expert for superconducting silicon spin interposer technical roadmap and program direction.
  • Lead development and refinement of silicon spin superconducting interposer manufacturing flows from wafer processing to advanced packaging.
  • Architect end‑to‑end process stacks and interposer layouts for high‑performance connectivity and cryogenic reliability.
  • Direct hands‑on manufacturing and characterization; drive structured experimentation and root‑cause investigations.
  • Establish and own the framework for silicon spin interposer fabrication, including design rules and reliability criteria.
  • Coordinate with internal design teams to align mask strategies, connectivity, RF, and cryogenic constraints.
  • Provide oversight to external manufacturing partners on materials, processes, and deep‑cryogenic performance expectations.
  • Integrate cryogenic mechanical, thermal, and RF requirements into all interposer stages; influence planning and capital equipment decisions.

Skills

Silicon spin superconducting
Cryogenic systems
Wafer fabrication
RF design constraints
Manufacturing leadership

Education

BS/MS/PhD in Electrical Engineering, Materials Science, Physics, Chemical Engineering

Tools

DOE
Data analysis tools
Modeling software
SPC

Job description

IBM Research in Yorktown Heights seeks a Quantum Interposer Technologist to lead silicon spin interposer technology development, process architecture, and manufacturing strategy, ensuring delivery of advanced interposer solutions.

You will guide wafer fabrication, finishing, multilayer integration, and cryogenic packaging, partnering with design teams and external partners to align on materials, RF constraints, and long‑range roadmaps.

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