Quantum Interposer Process Integration Engineer

IBM

Town of Yorktown (NY)

On-site

USD 150,000 - 210,000

Full time

31 hours ago
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Job summary

IBM Research in Yorktown Heights, NY seeks a Silicon spin Interposer Process Integration Engineer to drive end-to-end process flows for superconducting interposers and advanced wafer-level components. You will work cross-functionally with deposition, etch, lithography, bonding, and finishing teams to optimize performance, yield, and throughput.

The role requires a PhD with 7+ years in silicon spin interposer technologies and hands-on experience with semiconductor manufacturing processes.

Qualifications

  • PhD in a related field with strong publication/industry experience.
  • 7+ years of relevant experience in silicon spin interposer or related areas.
  • Hands-on experience with deposition, etch, lithography, wafer bonding, and finishing.

Responsibilities

  • Integrate end-to-end process flows for superconducting interposers and wafer-level components.
  • Collaborate with cross-functional teams to optimize throughput and yield.
  • Model and analyze process flows to identify bottlenecks and drive improvements.
  • Develop and document process integration strategies and troubleshooting methodologies.

Skills

Analytical thinking
Problem solving
Communication with leadership
DOE / statistical methods

Education

Doctorate (PhD) in Electrical Engineering, Physics, Chemistry, Materials Science, or related field

Tools

JMP
Post-processing & DOE tools

Job description

IBM Research in Yorktown Heights, NY seeks a Silicon spin Interposer Process Integration Engineer to drive end-to-end process flows for superconducting interposers and advanced wafer-level components. You will work cross-functionally with deposition, etch, lithography, bonding, and finishing teams to optimize performance, yield, and throughput.

The role requires a PhD with 7+ years in silicon spin interposer technologies and hands-on experience with semiconductor manufacturing processes.

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