Quantum Interposer Engineering Lead

International Business Machines Corporation; Town of Yorktown (NY); On-site; USD 150,000 - 190,000; Full time

Job summary

IBM Research in Yorktown Heights, NY seeks a Quantum Interposer Technologist to lead silicon spin interposer technology development, wafer fabrication, finishing, and advanced packaging. This role combines hands-on fabrication with strategic oversight across facilities planning, capital strategy, and long‑range road mapping.

The ideal candidate has deep expertise in superconductors, RF integration, and cryogenic applications, and can guide large, technical teams to deliver scalable interposer

Qualifications

• Doctorate degree in a relevant field.
• Proven expertise in silicon spin superconducting device fabrication and integration.
• Experience with cryogenic systems and interposer research and manufacturing.

Responsibilities

• Act as SME for superconducting silicon spin interposer technical roadmap and cross‑functional decisions.
• Lead development and refinement of silicon spin superconducting interposer fabrication flows and packaging approaches.
• Architect end‑to‑end interposer layouts to optimize high‑performance connectivity and cryogenic reliability.
• Direct hands‑on manufacturing and characterization efforts, including structured experiments and root‑cause analysis.
• Own governing framework for fabrication design rules, operational controls, and continuous improvement.

Skills

Silicon spin interposer fabrication

Cryogenic systems development

RF integration

Process optimization

Leadership

Education

Doctorate Degree

Tools

DOE

Data analysis

Statistical methods

Job description

IBM Research in Yorktown Heights, NY seeks a Quantum Interposer Technologist to lead silicon spin interposer technology development, wafer fabrication, finishing, and advanced packaging. This role combines hands-on fabrication with strategic oversight across facilities planning, capital strategy, and long‑range road mapping.

The ideal candidate has deep expertise in superconductors, RF integration, and cryogenic applications, and can guide large, technical teams to deliver scalable interposer