Senior Quantum Integration Engineer (Cross-Disciplinary)

GlobalFoundries inc.

Town of Malta (NY)

On-site

USD 118,000 - 210,000

Full time

6 days ago
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Job summary

GlobalFoundries inc. is seeking a Quantum Integration Engineer (SMTS) to lead the integration of semiconductor technologies enabling scalable quantum computing systems in the New York region.

The role requires oversight of integration architectures spanning front-end devices, BEOL routing, photonic interfaces, advanced packaging, and cryogenic interfaces, driving experimental roadmaps and manufacturability.

Qualifications

  • 15+ years of semiconductor process integration, technology development, or advanced manufacturing experience.
  • Experience leading cross-functional technical programs or major development initiatives.
  • Strong analytical, experimental design, and problem-solving capabilities.
  • Ability to clearly communicate complex technical concepts to engineering and leadership audiences.

Responsibilities

  • Lead development of semiconductor integration architectures for quantum computing platforms.
  • Define integration strategies across front-end devices, BEOL routing, photonic interfaces, and quantum-specific modules.
  • Drive integration optimization using DOE, statistics, and yield learning techniques.
  • Collaborate with device engineering, manufacturing, reliability, modeling, and packaging teams.

Skills

Analytical thinking
Experimental design
Cross-functional collaboration

Education

Associates Degree
BS in Electrical Engineering or related field
MS in Electrical Engineering or related field
PhD in Electrical Engineering or related field

Tools

MES systems
Foundry processing
BEOL technologies

Job description

GlobalFoundries inc. is seeking a Quantum Integration Engineer (SMTS) to lead the integration of semiconductor technologies enabling scalable quantum computing systems in the New York region.

The role requires oversight of integration architectures spanning front-end devices, BEOL routing, photonic interfaces, advanced packaging, and cryogenic interfaces, driving experimental roadmaps and manufacturability.

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