Quantum IC Package Substrate Design Engineer

Intel; Hillsboro (OR); On-site; USD 122,000 - 173,000; Full time

Benefits offered by this job

Competitive pay

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel Corporation in Oregon is seeking a Quantum IC Substrate Package Layout Design Engineer to design large form factor IC substrates and drive packaging innovation. You will collaborate with SI/PI/thermal/system engineers to meet design requirements and deliver milestones across the project lifecycle.

The role requires 5+ years of substrate design experience (or 3+ with MS) and hands-on Siemens Xpedition expertise, with opportunities to work on 2.5D/3D packaging and tapeouts in a cutting‑edge

Qualifications

• Degree in EE/CE or related field with required years of experience.
• Experience in IC substrate design for CPU/GPU/SoC/ASIC.
• Proficiency with Siemens Xpedition environment and workflow.

Responsibilities

• Design IC substrates for large form factor packages.
• Collaborate with silicon test, SI, PI, thermal, and system engineers.
• Deliver milestones and documentation to stakeholders.
• Perform design validation including DRC and LVS.
• Integrate advanced packaging (2.5D/3D) with substrates.
• Tapeout designs with substrate suppliers and Intel teams.
• Present designs and stay current with packaging tech.

Skills

High-speed signal routing

SI/PI considerations

Education

B.S. in Electrical Engineering or Computer Engineering

M.S. in Electrical Engineering or Computer Engineering

Tools

Siemens Xpedition

Job description

Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting‑edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide.

We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing.

Key Responsibilities

• Design of IC substrates using Siemens Xpedition IC package design software
• Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers
• Deliver and disseminate design milestones to stakeholders
• Design validation and verification; including DRC and LVS
• Advanced packaging design integration (2.5D and 3D) with IC substrate
• Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams
• Communicate designs in presentations and relevant documentation
• Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers

As a successful candidate, you must possess

Qualifications:

Minimum Qualifications:

B.S. degree in Electrical Engineering, Computer Engineering, or a related field AND 5+ years of experience in IC substrate design for CPU, GPU, SoC/ASIC, and/or relevant design architectures.
OR M.S. degree in Electrical Engineering, Computer Engineering, or a related field AND 3+ years of experience in IC substrate design for CPU, GPU, SoC/ASIC, and/or relevant design architectures.

The experience must include:

• Siemens Xpedition design environment and workflow.
• High-speed signal routing.
• Experience with large form factor IC substrates.

Preferred Qualifications:

• 1+ years of experience with advanced routing engines for IC substrate design. Examples include AI and physics/model-based routing engines.
• Proficiency with understanding SI/PI/thermal impact on IC substrate design choices.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US:

$122,440.00-172,860.00 USD