Product Engineer - AI Server Racks & Heavy-Duty Packaging

Foxconn-Pce-Technology; Santa Clara (CA); On-site; USD 125,000 - 155,000; Full time

Job summary

Foxconn-Pce-Technology in Santa Clara, CA, seeks a Product Engineer to bridge R&D, customers, and manufacturing for next-generation L11 AI server racks. You will own BOM/ECN, manage product configurations, and ensure secure, heavy-duty packaging.

The role focuses on translating customer specs into manufacturing requirements, leading ECO/ECN processes, and coordinating with R&D, Quality, Testing, and Supply Chain to prevent delays while upholding packaging standards.

Qualifications

• Bachelor's degree required in Industrial, Mechanical, Packaging Engineering or related field.
• 4–7 years in Product Engineering, NPI, or Packaging Engineering in electronics manufacturing or server industry; experience with L10/L11/L12 racks or heavy equipment packaging.
• Experience managing BOMs and ECN/ECO using PLM/ERP systems; familiarity with ISTA or ASTM packaging standards.

Responsibilities

• Own the Manufacturing BOM (MBOM) and translate customer specs into manufacturing requirements; lead ECO/ECN implementation without delaying NPIs.
• Coordinate with R&D, Quality, Testing, and Supply Chain to resolve design issues, shortages, and assembly deviations.
• Lead the design and validation of heavy-duty packaging solutions for extremely heavy L11 AI racks and ensure robust transit protection.

Skills

BOM coordination

ECN/ECO management

PLM/ERP proficiency

Heavy equipment packaging

Cross-functional communication

Education

Industrial Engineering

Mechanical Engineering

Packaging Engineering

Tools

Agile

SAP

Windchill

Job description

Foxconn-Pce-Technology in Santa Clara, CA, seeks a Product Engineer to bridge R&D, customers, and manufacturing for next-generation L11 AI server racks. You will own BOM/ECN, manage product configurations, and ensure secure, heavy-duty packaging.

The role focuses on translating customer specs into manufacturing requirements, leading ECO/ECN processes, and coordinating with R&D, Quality, Testing, and Supply Chain to prevent delays while upholding packaging standards.