Product Engineer

Foxconn-Pce-Technology; Santa Clara (CA); On-site; USD 125,000 - 155,000; Full time

Job summary

Foxconn-Pce-Technology in Santa Clara, CA, seeks a Product Engineer to bridge R&D, customers, and manufacturing for next-generation L11 AI server racks. You will own BOM/ECN, manage product configurations, and ensure secure, heavy-duty packaging.

The role focuses on translating customer specs into manufacturing requirements, leading ECO/ECN processes, and coordinating with R&D, Quality, Testing, and Supply Chain to prevent delays while upholding packaging standards.

Qualifications

• Bachelor's degree required in Industrial, Mechanical, Packaging Engineering or related field.
• 4–7 years in Product Engineering, NPI, or Packaging Engineering in electronics manufacturing or server industry; experience with L10/L11/L12 racks or heavy equipment packaging.
• Experience managing BOMs and ECN/ECO using PLM/ERP systems; familiarity with ISTA or ASTM packaging standards.

Responsibilities

• Own the Manufacturing BOM (MBOM) and translate customer specs into manufacturing requirements; lead ECO/ECN implementation without delaying NPIs.
• Coordinate with R&D, Quality, Testing, and Supply Chain to resolve design issues, shortages, and assembly deviations.
• Lead the design and validation of heavy-duty packaging solutions for extremely heavy L11 AI racks and ensure robust transit protection.

Skills

BOM coordination

ECN/ECO management

PLM/ERP proficiency

Heavy equipment packaging

Cross-functional communication

Education

Industrial Engineering

Mechanical Engineering

Packaging Engineering

Tools

Agile

SAP

Windchill

Job description

If you are unable to complete this application due to a disability, contact this employer to ask for an accommodation or an alternative application process.

All Salaried exempt employees Full-Time Santa Clara, CA, US

4 days ago Requisition ID: 1303

Salary Range: $125,000.00 To $155,000.00 Annually

Company Overview:

Established in Taiwan in 1974, Hon Hai Technology Group, commonly known as Foxconn, is the world’s largest electronics manufacturer and leading provider of technological solutions with a network of over 233 campuses across 24 countries. In the US, Foxconn employs 8,000 across 56 different sites with manufacturing operations in Virginia, Wisconsin, Ohio, Indiana, Texas, and California. As of 2025, Foxconn ranks 28 th among the Fortune Global 500 and reported revenue of approximately USD $259 billion.

The company’s diverse product offerings span four major segments: smart consumer electronics, cloud, and networking solutions, computing, and various other components. Foxconn makes 40% of the consumer electronics that we find in our everyday lives. In recent years, Hon Hai has adopted the 3+3 strategy, focusing on three emerging industries - electric vehicles, digital health solutions, and robotics - while leveraging three key technologies: next-generation communications, artificial intelligence (AI), and semiconductors. Together, these initiatives position the company as a leader in innovation for the 21st century.

Hon Hai Technology Group is deeply committed to championing environmental sustainability within its manufacturing processes. By integrating sustainability into its operations framework, the company strives to serve as a best-practice model for global enterprises, enhancing corporate responsibility while meeting the growing demand for environmentally conscious production methods.

Job Summary:

The Product Engineer is a vital technical liaison for the Silicon Valley AI Rack NPI Center, bridging the gap between R&D, customers, and the manufacturing floor for next-generation L11 AI server racks. Reporting to the ME Manager, this dual-focus role is responsible for both Product Specification management (BOM, ECN/ECO, product configuration) and Packaging Specification design. The ideal candidate will ensure that complex AI server products are built strictly to customer specifications and are securely packaged with industrial-grade, shock-absorbing solutions to withstand the rigors of global shipping.

Duties and Responsibilities:

• Product Specification & Change Management (ECO/ECN): Act as the owner of the Manufacturing Bill of Materials (MBOM) to translate customer specifications into manufacturing requirements, and lead the implementation of ECO/ECN without disrupting NPI schedules.
• Cross-Functional Issue Resolution: Serve as the primary ME contact for product-level issues, collaborating with R&D, Quality, Testing, and Supply Chain to resolve design bugs, parts shortages, and assembly deviations.
• Heavy-Duty Packaging Design: Lead the design, specification, and validation of custom wooden crates, heavy-duty shock-absorbing pallets, and structural ramps for extremely heavy L11 AI Racks.
• Packaging Validation & Testing: Coordinate packaging reliability testing (such as drop, shock, vibration, and tilt tests), ensuring liquid cooling (DLC) systems are protected and tilt/shock indicators are utilized during transit.
• Standardization & Documentation: Create and maintain comprehensive Packaging Standard Operating Procedures (SOPs) and Product Configuration guides, ensuring packing line operators are properly trained.

Education:

• A Bachelor's degree is required for this position.
• The degree must be in Industrial Engineering, Mechanical Engineering, Packaging Engineering, or a related technical field.

Experience:

• Industry & Product Experience: 4 - 7 years of experience in Product Engineering, NPI, or Packaging Engineering within the electronics manufacturing or server industry, with direct experience required in L10/L11/L12 server racks or heavy industrial equipment packaging.
• Systems & Standards Proficiency: Proven experience managing complex BOMs and ECN/ECO processes using PLM/ERP systems (e.g., Agile, SAP, Windchill), as well as familiarity with ISTA or ASTM packaging test standards for heavy machinery.
• Cross-Functional Communication: Excellent communication skills with the demonstrated ability to interface effectively with global R&D teams and demanding Tier-1 customers.

EEOC Statement

Foxconn is an equal opportunity employer that is committed to diversity and inclusion in the workplace. Foxconn prohibits discrimination and harassment of any kind and provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, gender, religion, sex, sexual orientation, ethnicity or national origin, age, disability, marital status, genetics, pregnancy, or any other protected characteristic as outlined by federal law. In addition to federal law requirements, Foxconn complies with applicable state and local laws governing nondiscrimination in employment in every location in which the company has facilities. This policy applies to all terms and conditions of employment, including recruiting, hiring, placement, promotion, termination, layoff, recall, and transfer, leaves of absence, compensation, and training.