Process Integration Engineer - Next-Gen Glass Packaging

Absolics Inc.; Covington (GA); On-site; USD 90,000 - 150,000; Full time

Benefits offered by this job

401K matching

Healthcare coverage

Job summary

Absolics Inc. is seeking a highly skilled R&D Engineer - Process Integration to orchestrate and integrate critical steps across dielectric materials selection, lithography, cleaning, PVD, and electroplating to form a coherent process flow for next-generation packaging architectures.

The role partners with lithography, wet/dry processes, dielectric, and plating teams to translate capabilities into an end-to-end solution.

Qualifications

• Experience integrating multi-step package build-up flow from lithography through metallization and dielectric build-up.
• Strong knowledge of photolithography, wet/dry etch, PVD seed deposition, dielectric film processing, and electroplating.
• Ability to author Process Integration Plans, design rules, and process flow documentation.

Responsibilities

• Oversee process integration, manage scheduling, and provide progress reports to upper management.
• Develop and implement process integration strategies to optimize yield and efficiency.
• Coordinate with cross-functional teams to ensure seamless integration of processes.
• Monitor and analyze process performance, identifying areas for improvement.
• Ensure compliance with industry standards and safety regulations.
• Troubleshoot and resolve process-related issues in a timely manner.
• Maintain detailed documentation of processes and procedures.
• Generate innovative ideas for patent filings.

Skills

Process integration

Dielectric materials

Lithography

PVD and electroplating

Cross-functional collaboration

DOE methodology

Data interpretation

Education

Ph.D. in Materials Science or related field

M.S. in relevant field + 5+ years experience

Tools

SAP

Job description

Absolics Inc. is seeking a highly skilled R&D Engineer - Process Integration to orchestrate and integrate critical steps across dielectric materials selection, lithography, cleaning, PVD, and electroplating to form a coherent process flow for next-generation packaging architectures.

The role partners with lithography, wet/dry processes, dielectric, and plating teams to translate capabilities into an end-to-end solution.