Process Integration Engineer

Lumicity; Georgia; On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

Job summary

Lumicity in Covington, GA, is hiring a Process Integration Engineer to lead substrate integration from customer requirements through qualification and mass production. This onsite role interfaces with customers and internal teams to resolve cross-process issues and drive rapid, data-driven improvements.

You will apply SPC/DOE/FMEA methods and own end-to-end process knowledge, including material prep, via formation, lamination, lithography, etching, plating, inspection, electrical test, and final

Qualifications

• 7+ years of engineering experience in semiconductor packaging, substrate manufacturing, process integration, product engineering, or technology development.
• Strong understanding of advanced packaging and end-to-end glass or organic substrate manufacturing.
• Experience leading customer-facing and cross-functional technical programs in a semiconductor manufacturing environment.
• Proven ability to diagnose cross-process issues, clarify ownership, and lead root-cause resolution.
• Ability to turn customer requirements into technical specs, process flows, and qualification plans.
• Strong communication, data analysis, and executive-level stakeholder skills.
• Authorization to work in the United States.

Responsibilities

• Lead substrate integration from customer requirements and design review through qualification, -ramp, and mass production.
• Translate customer performance, quality, reliability, schedule, and cost requirements into internal specifications and action plans.
• Maintain end-to-end knowledge of substrate processes: material prep, via formation, lamination, lithography, etching, plating, inspection, electrical test, and final QA.
• Resolve technical gray zones between process modules where ownership, specs, or root causes are unclear.
• Lead cross-process troubleshooting on yield, defect, reliability, dimensional, warpage, adhesion, alignment, contamination, and electrical issues.
• Coordinate Process, Equipment, Manufacturing, Quality, Reliability, Product, and Design teams on ownership, containment, root cause, corrective action, and closure.
• Set process-interface criteria, monitor technical risks and KPIs, and report status to customers and management.
• Apply SPC, DOE, FMEA, and structured problem-solving to improve capability, yield, and reliability.

Skills

Semiconductor packaging

Process integration

Customer programs

Root-cause analysis

DOE

Statistical Process Control

Cross-functional leadership

Education

Bachelor's degree in Materials Science, Chemical, Mechanical, or Electrical Engineering, Chemistry, Physics, or related field

Master's degree preferred

Job description

Lumicity is partnering with a pioneering advanced packaging substrate manufacturer serving the high-performance computing market. They are hiring a Process Integration Engineer to lead substrate integration from customer requirements through qualification and mass production.

Please note: this is a fully onsite role in Covington, GA. Remote and hybrid work are not available.

The role

You will be the primary customer technical interface and the owner of cross-process "gray-zone" issues. That means aligning internal teams, finding root causes, and driving fast resolution.

What you\'ll do

• Lead substrate integration from customer requirements and design review through qualification, -ramp, and mass production
• Translate customer performance, quality, reliability, schedule, and cost requirements into internal specifications and action plans
• Maintain end-to-end knowledge of substrate processes: material prep, via formation, lamination, lithography, etching, plating, inspection, electrical test, and final QA
• Resolve technical gray zones between process modules where ownership, specs, or root causes are unclear
• Lead cross-process troubleshooting on yield, defect, reliability, dimensional, warpage, adhesion, alignment, contamination, and electrical issues
• Coordinate Process, Equipment, Manufacturing, Quality, Reliability, Product, and Design teams on ownership, containment, root cause, corrective action, and closure
• Set process-interface criteria, monitor technical risks and KPIs, and report status to customers and management
• Apply SPC, DOE, FMEA, and structured problem-solving to improve capability, yield, and reliability

What you\'ll bring

• 7+ years of engineering experience in semiconductor packaging, substrate manufacturing, process integration, product engineering, or technology development
• Strong understanding of advanced packaging and end-to-end glass or organic substrate manufacturing
• Experience leading customer-facing and cross-functional technical programs in a semiconductor manufacturing environment
• Proven ability to diagnose cross-process issues, clarify ownership, and lead root-cause resolution
• Ability to turn customer requirements into technical specs, process flows, and qualification plans
• Strong communication, data analysis, and executive-level stakeholder skills
• Bachelor\'s degree in Materials Science, Chemical, Mechanical, or Electrical Engineering, Chemistry, Physics, or a related field (master\'s preferred)
• Authorization to work in the United States

Nice to have

• Hands-on experience with technology qualification, NPI, manufacturing ramp, yield improvement, or high-volume production.