Process Engineer – Die to Wafer Hybrid Bonding

Applied Materials, Inc.; Santa Clara (CA); On-site; USD 147,000 - 203,000; Full time

Benefits offered by this job

Bonus program

Stock awards

Relocation assistance

Job summary

Applied Materials, Inc. in Santa Clara, CA is seeking a Process Engineer to design and optimize manufacturing processes for display and semiconductor technologies.

You will collect and analyze data, perform hardware characterization, and troubleshoot engineering issues. Join the Photonics Platforms Business Group at Applied Materials’ Santa Clara headquarters to work on state‑of‑the‑art 2.5D/3D advanced packaging technologies and cross‑functional collaboration with vendors; on‑the‑job training

Qualifications

• PhD or MS in Materials Science, Electrical Engineering, Applied Physics, or related STEM field.
• Experience with semiconductor manufacturing processes and DOE/SPC methods.
• Strong problem-solving and communication skills.

Responsibilities

• Develop die-to-wafer hybrid bonding processes with surface prep and alignment.
• Integrate D2W bonding with adjacent modules and perform DOE‑driven experiments.
• Own process optimization, failure analysis, and continuous engineering improvement.

Skills

Problem solving

Independent work

Communication

Team collaboration

Self starter

Education

PhD or MS in STEM

Tools

JMP

Job description

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting‑edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.

What We Offer

Salary: $147,000.00 - $202,500.00

Location: Santa Clara, CA

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company.

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

As a Process Engineer

As a Process Engineer, you'll play a crucial role in designing and optimizing manufacturing processes for display and semiconductor manufacturing technologies. You will collect and analyze data, perform hardware characterization, and troubleshoot engineering issues. You'll also measure film properties, generate technical documentation, and engage with customers to resolve concerns. Process Engineers collaborate with vendors and suppliers, and become familiar with implementing new technologies and products. You will experiment, learn, and collaborate with some of the brightest minds in the semiconductor and display industries, partnering with our globally recognized R&D teams on state‑of‑the‑art research and development projects. Join the Photonics Platforms Business Group at Applied Materials’ Santa Clara headquarters, where you will work with a cross‑functional research team to develop cutting‑edge 2.5D/3D advanced packaging technologies. We are seeking hands on Process Engineers to drive die to wafer (D2W) hybrid bonding R&D. This role focuses on hybrid bonding process development, pathfinding, technology de‑risking, and advanced packaging integration exploration. The role provides on the job training and hands on experience with state of the art equipment, including the industry’s first fully integrated die to wafer hybrid bonding system.

Key Responsibilities

• Develop die to wafer hybrid bonding processes, including (but not limited to): Surface preparation and plasma activation High accuracy die placement and alignment Post bond characterization and process evaluation


• Integrate D2W bonding with adjacent process modules such as: Dicing and die preparation Die thinning Inter die gap fill and planarization


• Design and execute DOE driven experiments to understand process limits, sensitivities, and trade offs.


• Own process optimization, perform failure analysis and characterization, and drive continuous engineering improvement.

Qualifications

• Ph.D. or M. S. in Materials Science, Electrical Engineering, Applied Physics, or a related STEM discipline.


• In depth knowledge and hands on experience in one or more of the following: Die to wafer or wafer to wafer hybrid bonding Thin die handling and alignment critical processes Micro-LED or CPO experience Heterogeneous integration such as III-V to Si, novel materials to Si 2.5D/3D integration Direct process engineer experience on mainstream semiconductor equipment (plasma, wet clean, overlay/alignment, etc.)


• Strong understanding of: Bond interface physics Alignment and overlay fundamentals Mechanical behavior of thin and fragile dies


• Proficiency in statistical analysis and process control (e.g., DOE, SPC, JMP).


• Self starter with strong problem solving skills; able to work both independently and collaboratively with minimal supervision.


• Strong communication and interpersonal skills, with the ability to collaborate effectively across multidisciplinary teams.

Additional Information

• Time Type: Full time


• Employee Type: Assignee / Regular


• Travel: Yes, 10% of the Time


• Relocation Eligible: Yes

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job‑related knowledge, skills, experience, and with consideration of internal equity of our current team members.

In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

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