Process Development Engineering Intern

MACOM; Morgan Hill, Northern (CA, KY); Hybrid; USD 28,000 - 65,000; Full time

Job summary

MACOM invites applications for a Process Development Engineering Intern in Morgan Hill, CA. The role covers backend assembly and package development for RF power products, with hands-on learning in tooling, material selection, and process qualification within a dynamic, fast-paced environment.

The program runs for 12 weeks, offering practical project work, regular reviews, and exposure to cross-functional teams, with an emphasis on reliability and yield improvements.

Qualifications

• BS/MS preferably in mechanical, material, industrial Engineering or related field.
• Hands-on experience with backend assembly processes for RF power packages a plus.
• Experience with FMEA/DFMEA/PFMEA, SPC, Pareto Analysis, Control Charts and DoE.

Responsibilities

• Develop backend assembly processes and package developments for RF power products.
• Support technology development projects from specifications to tooling and material selection.
• Participate in verification and qualification of new tooling and equipment with vendors and internal teams.
• Create and review design and equipment process FMEA; provide technical manufacturing support.

Skills

FMEA/DFMEA/PFMEA

DoE

Statistical analysis

Problem solving

Project management

Education

BS/MS in mechanical, material, industrial engineering

Tools

JMP

AutoCad

Job description

MACOM (NASDAQ: MTSI) is a global leader in the design and manufacture of advanced semiconductor products across a diverse range of end markets, including Data Centers, Telecommunications, Industrial and Aerospace and Defense. We develop innovative, cutting-edge technologies and products across the spectrum of radio frequency (RF), microwave, millimeter wave, photonics and high-speed analog technologies. Our solutions support critical network infrastructure applications like artificial intelligence, high performance computing, satellite communications, radar, unmanned aerial vehicles, medical equipment, test and measurement and advanced wireless networks.MACOM has more than 75 years of expertise in semiconductor process development, wafer fabrication, circuit design, advanced packaging, systems architecture and applications engineering. We are committed to our customers' success. We partner with customers to help solve their most challenging problems by providing semiconductor solutions that are at the forefront of the highest power, highest frequency and/or highest data rates.Leading technologies, innovative products and driven employees. Come be a part of MACOM and help advance the next generation of connectivity infrastructure!**Process Development Engineering Intern****Responsibilities:**- Developing Backend Assembly Process and/or Package Developments for RF Power products- Participate in technology development projects which may include: defining the specifications, guidelines and developing assembly processes with process recipe development, equipment upgrade and material selection- Anticipate and propose solution to mitigate potential issues and limitation of process/material/equipment throughout the development stages.- Perform continuous improvement activities of existing assembly processes, equipment and materials for quality improvement and cost saving- Design new customized tooling to adopt off the shelf equipment for our high-volume production.- Perform verification and qualification activities for new tooling, machine and materials in development projects- Work directly with equipment vendors, subcontractors and internal team to qualify, bring up and debug equipment.- Creation, regular review and updating of design & equipment process FMEA- Technical support on Manufacturing with troubleshooting and providing technical solution- Participate in new product introduction with material selection, process developments, and data review, as technical expert- Conduct risk assessments and mitigation as well as project reviews and report the results to the executive level on a regular basis- Coordinate and support initial mechanical reliability test with failure analysis for root cause finding**Requirements:**- BS. MS preferably in mechanical, material, industrial Engineering, MaterialEngineering, Applied Science, or other relevant qualification- Minimum 8+ years of relevant experience in the function of package and assembly process development such as die attach, SMT, Lid attach.- Must be able to utilize die bond equipment such as Datacon EVO.- Possess in depth technical knowledge and hands on experience on semiconductor backend assembly processes for RF Power Packages- Hands on experience on engineering methods such as FMEA/DFMEA/PFMEA, SPC, Pareto Analysis, Control Charts, 8D methodology and DoE.- Proven experience in project management, document accurately, communicate with intention, report efficiently, pre-empt risk, and drive for the best possible outcome for the customer, for the company, and for the team members- Solid experience and technical understanding in semiconductor reliability standards and test methods- Experience in materials characterization and analysis, DOE, reliability standards, and FA technique is preferred- Experience in low, medium and high-volume manufacturing for high RF**Power Products is preferred**- Strong background in statistical analysis and proficient in the use of statistical analysis software packages such as JMP- Familiar with design tools such as AutoCad- Good analytical and problem solving skills with a keen attention to details- Excellent written and verbal communication skills- Ability to thrive in a fast-paced, result oriented growth business- Ability to work in the situation with uncertainty with minimum guideline**During the 12 weeks each Intern will:**- Be given an individual and well-defined project with set outcome goals- Gain hands on experience- Receive excellent training and ongoing supervision- Be invited to attend an intern webinar series- Attend networking/social events- Attend and present at Poster Session about each Interns project successes and pitfalls- Receive formal, written feedbackThe Hourly Range for this position is $20 - $47 per hour. Actual salary offered to candidate will depend on several factors, including but not limited to, work location, relevant candidates' experience, education, and specific knowledge, skills, and abilities.**EEO:**MACOM is an Equal Opportunity Employer committed to a diverse workforce. MACOM will not discriminate against any worker or job applicant on the basis of race, color, religion, sex, gender identity, sexual orientation, national origin, age, disability, genetic information, veteran status, military service, marital status, or any other category protected under applicable law.**Reasonable Accommodation:**MACOM is committed to working with and providing reasonable accommodations to qualified individuals with physical and mental disabilities. If you have a disability and are in need of a reasonable accommodation with respect to any part of the application process please call [phone] or email HR\\[e-mail]. Provide your name, phone number and the position title and location in which you are interested, and nature of accommodation needed, and we will get back to you. We also work with current employees who request or need reasonable accommodation in order to perform the essential functions of their jobs.